Influence of the powder metallurgy route on the mechanical properties of Cu–Cr–diamond composites

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Authors

  • Berend Denkena
  • Benjamin Bergmann
  • Roman Lang
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Details

Original languageEnglish
Article number161
JournalSN Applied Sciences
Volume4
Issue number6
Early online date10 May 2022
Publication statusPublished - Jun 2022

Abstract

Abstract: Metal-bonded grinding tools are commonly based on copper as bond material and possess low porosity. The powder metallurgic fabrication and the applied process parameters have a high influence on the mechanical properties of these grinding layers. In this study, Cu–diamond composites are fabricated through Field Assisted Sintering Technology with a variation of holding time, temperature, pressure, and chromium powder particle size. The addition of chromium to these composites can ensure a higher adhesion of the diamonds through carbide formation within the interface of the diamonds and the copper bonding matrix. The coating of diamond with chromium-carbide is mainly controlled by the chromium powder particle size, which leads to a higher critical bond strength with decreasing particle size. Maximum critical bond strength of 463 N/mm2 is reached using chromium with an average particle size of 10 µm. Increasing holding time decreases porosity and increases the critical bond strength of the composites. An increase of sintering temperature from 900 to 1040 °C leads to a decrease of porosity due to local melting of the copper. The interlocking of diamonds due to their high concentration of 50 vol% within the composites results in a relatively high porosity above 7%. Article Highlights: Modelling of the influence of sintering temperature, sintering time and chromium particle size on the critical bond strengthAddition of chromium results in an in-situ formed carbide-layer when sintering above a temperature of 900 °CSmaller chromium particle sizes significant increase the mechanical stability of CuCr–diamond composites

Keywords

    Abrasion, Carbides, Composites, Cutting tools, High pressure high temperature (HTHP), Interface characterization, Mechanical properties characterization, Synthetic diamond

ASJC Scopus subject areas

Cite this

Influence of the powder metallurgy route on the mechanical properties of Cu–Cr–diamond composites. / Denkena, Berend; Bergmann, Benjamin; Lang, Roman.
In: SN Applied Sciences, Vol. 4, No. 6, 161, 06.2022.

Research output: Contribution to journalArticleResearchpeer review

Denkena B, Bergmann B, Lang R. Influence of the powder metallurgy route on the mechanical properties of Cu–Cr–diamond composites. SN Applied Sciences. 2022 Jun;4(6):161. Epub 2022 May 10. doi: 10.1007/s42452-022-05048-2
Denkena, Berend ; Bergmann, Benjamin ; Lang, Roman. / Influence of the powder metallurgy route on the mechanical properties of Cu–Cr–diamond composites. In: SN Applied Sciences. 2022 ; Vol. 4, No. 6.
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abstract = "Abstract: Metal-bonded grinding tools are commonly based on copper as bond material and possess low porosity. The powder metallurgic fabrication and the applied process parameters have a high influence on the mechanical properties of these grinding layers. In this study, Cu–diamond composites are fabricated through Field Assisted Sintering Technology with a variation of holding time, temperature, pressure, and chromium powder particle size. The addition of chromium to these composites can ensure a higher adhesion of the diamonds through carbide formation within the interface of the diamonds and the copper bonding matrix. The coating of diamond with chromium-carbide is mainly controlled by the chromium powder particle size, which leads to a higher critical bond strength with decreasing particle size. Maximum critical bond strength of 463 N/mm2 is reached using chromium with an average particle size of 10 µm. Increasing holding time decreases porosity and increases the critical bond strength of the composites. An increase of sintering temperature from 900 to 1040 °C leads to a decrease of porosity due to local melting of the copper. The interlocking of diamonds due to their high concentration of 50 vol% within the composites results in a relatively high porosity above 7%. Article Highlights: Modelling of the influence of sintering temperature, sintering time and chromium particle size on the critical bond strengthAddition of chromium results in an in-situ formed carbide-layer when sintering above a temperature of 900 °CSmaller chromium particle sizes significant increase the mechanical stability of CuCr–diamond composites",
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AU - Bergmann, Benjamin

AU - Lang, Roman

N1 - Funding Information: Open Access funding enabled and organized by Projekt DEAL. The authors would like to thank the German Research Foundation (DFG) for their organizational and financial support within the project DE447/184-1.

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N2 - Abstract: Metal-bonded grinding tools are commonly based on copper as bond material and possess low porosity. The powder metallurgic fabrication and the applied process parameters have a high influence on the mechanical properties of these grinding layers. In this study, Cu–diamond composites are fabricated through Field Assisted Sintering Technology with a variation of holding time, temperature, pressure, and chromium powder particle size. The addition of chromium to these composites can ensure a higher adhesion of the diamonds through carbide formation within the interface of the diamonds and the copper bonding matrix. The coating of diamond with chromium-carbide is mainly controlled by the chromium powder particle size, which leads to a higher critical bond strength with decreasing particle size. Maximum critical bond strength of 463 N/mm2 is reached using chromium with an average particle size of 10 µm. Increasing holding time decreases porosity and increases the critical bond strength of the composites. An increase of sintering temperature from 900 to 1040 °C leads to a decrease of porosity due to local melting of the copper. The interlocking of diamonds due to their high concentration of 50 vol% within the composites results in a relatively high porosity above 7%. Article Highlights: Modelling of the influence of sintering temperature, sintering time and chromium particle size on the critical bond strengthAddition of chromium results in an in-situ formed carbide-layer when sintering above a temperature of 900 °CSmaller chromium particle sizes significant increase the mechanical stability of CuCr–diamond composites

AB - Abstract: Metal-bonded grinding tools are commonly based on copper as bond material and possess low porosity. The powder metallurgic fabrication and the applied process parameters have a high influence on the mechanical properties of these grinding layers. In this study, Cu–diamond composites are fabricated through Field Assisted Sintering Technology with a variation of holding time, temperature, pressure, and chromium powder particle size. The addition of chromium to these composites can ensure a higher adhesion of the diamonds through carbide formation within the interface of the diamonds and the copper bonding matrix. The coating of diamond with chromium-carbide is mainly controlled by the chromium powder particle size, which leads to a higher critical bond strength with decreasing particle size. Maximum critical bond strength of 463 N/mm2 is reached using chromium with an average particle size of 10 µm. Increasing holding time decreases porosity and increases the critical bond strength of the composites. An increase of sintering temperature from 900 to 1040 °C leads to a decrease of porosity due to local melting of the copper. The interlocking of diamonds due to their high concentration of 50 vol% within the composites results in a relatively high porosity above 7%. Article Highlights: Modelling of the influence of sintering temperature, sintering time and chromium particle size on the critical bond strengthAddition of chromium results in an in-situ formed carbide-layer when sintering above a temperature of 900 °CSmaller chromium particle sizes significant increase the mechanical stability of CuCr–diamond composites

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