Details
| Original language | English |
|---|---|
| Pages (from-to) | 387-390 |
| Number of pages | 4 |
| Journal | Conference Record of IEEE International Symposium on Electrical Insulation |
| Publication status | Published - 2002 |
| Event | 2002 IEEE International Symposium on Electrical Insulation - Boston, MA, United States Duration: 7 Apr 2002 → 10 Apr 2002 |
Abstract
Experimental investigations concerning the influence of the cure parameters on the partial discharge inception voltage (PDIV) of four heat-resistant cast resin systems are presented and discussed in this paper. The tests were performed on two epoxy resin systems in combination with silica flour and wollastonite, respectively, with different post-cure parameters. The PDIV was measured in a non-uniform electrical field in dependence on the temperature. The contribution reveals that a raise of the cure temperature can lead to a significant decline of the PDIV.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Building and Construction
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In: Conference Record of IEEE International Symposium on Electrical Insulation, 2002, p. 387-390.
Research output: Contribution to journal › Conference article › Research › peer review
}
TY - JOUR
T1 - Influence of the cure parameters on the partial discharge behavior of cast resins
AU - Kotte, R.
AU - Gockenbach, Ernst
AU - Borsi, Hossein
PY - 2002
Y1 - 2002
N2 - Experimental investigations concerning the influence of the cure parameters on the partial discharge inception voltage (PDIV) of four heat-resistant cast resin systems are presented and discussed in this paper. The tests were performed on two epoxy resin systems in combination with silica flour and wollastonite, respectively, with different post-cure parameters. The PDIV was measured in a non-uniform electrical field in dependence on the temperature. The contribution reveals that a raise of the cure temperature can lead to a significant decline of the PDIV.
AB - Experimental investigations concerning the influence of the cure parameters on the partial discharge inception voltage (PDIV) of four heat-resistant cast resin systems are presented and discussed in this paper. The tests were performed on two epoxy resin systems in combination with silica flour and wollastonite, respectively, with different post-cure parameters. The PDIV was measured in a non-uniform electrical field in dependence on the temperature. The contribution reveals that a raise of the cure temperature can lead to a significant decline of the PDIV.
UR - http://www.scopus.com/inward/record.url?scp=0036075507&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0036075507
SP - 387
EP - 390
JO - Conference Record of IEEE International Symposium on Electrical Insulation
JF - Conference Record of IEEE International Symposium on Electrical Insulation
SN - 0164-2006
T2 - 2002 IEEE International Symposium on Electrical Insulation
Y2 - 7 April 2002 through 10 April 2002
ER -