Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization

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Original languageEnglish
Title of host publication2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Publication statusPublished - 2012
Event2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 - Cascais, Portugal
Duration: 16 Apr 201218 Apr 2012

Publication series

Name2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012

Abstract

An exemplified calculation of migration effects was carried out for a via structure of 32nm node dimensions with wide lines. In the mechanical simulation the process-induced stress was considered in the simulations. The mass flux divergence was determined using a user routine which allows the calculation of migration effects under EM and SM load. The investigated cases show a very good correlation between simulation and measurements from literature. Additional the influence of new barrier materials like Ruthenium, as well as different dielectrics on the thermal-electrical mechanical behaviour was investigated.

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Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. / Kludt, Jörg; Ciptokusumo, J.; Weide-Zaage, K.
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191701 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Kludt, J, Ciptokusumo, J & Weide-Zaage, K 2012, Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012., 6191701, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal, 16 Apr 2012. https://doi.org/10.1109/ESimE.2012.6191701
Kludt, J., Ciptokusumo, J., & Weide-Zaage, K. (2012). Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. In 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 Article 6191701 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012). https://doi.org/10.1109/ESimE.2012.6191701
Kludt J, Ciptokusumo J, Weide-Zaage K. Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. In 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191701. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012). doi: 10.1109/ESimE.2012.6191701
Kludt, Jörg ; Ciptokusumo, J. ; Weide-Zaage, K. / Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization. 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
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AU - Kludt, Jörg

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AU - Weide-Zaage, K.

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