Details
| Original language | English |
|---|---|
| Title of host publication | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| Subtitle of host publication | Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 676-681 |
| Number of pages | 6 |
| ISBN (electronic) | 979-8-3503-3498-2 |
| ISBN (print) | 979-8-3503-3499-9 |
| Publication status | Published - May 2023 |
Publication series
| Name | Proceedings - Electronic Components Conference |
|---|---|
| ISSN (Print) | 0569-5503 |
| ISSN (electronic) | 2377-5726 |
Abstract
Keywords
- AgSn, TLP, shear strength, silver sintering
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. p. 676-681 (Proceedings - Electronic Components Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
AU - Hadeler, Steffen
AU - Long, Yangyang
AU - Ottermann, Rico
AU - Dencker, Folke
AU - Twiefel, Jens
AU - Wurz, Marc Christopher
N1 - Funding information: This work was funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) (Project ID 456662835) at the Institute for Micro Production Technology and the Institute of Dynamics and Vibration Research.
PY - 2023/5
Y1 - 2023/5
N2 - Current limitations of silver sintering are long processing times and high processing temperatures. To overcome these restrictions, different tin contents are added to the sintering paste. Various preheating times and processing times are evaluated at a processing temperature of 235°C. The positive effect of micro scale tin particles on shear strength and porosity at reduced process parameters is demonstrated. The addition of tin particles enables a reduction of both the processing temperature and time while maintaining high shear strengths. At a processing time of 60 s and no preheating time, the addition of 27.5 at% tin to the sintering paste leads to an increase in shear strength of 417 % from 4.6 MPa to 19.2 MPa, compared to the sintering paste without an alloying element. Energy-dispersive X-ray spectroscopy shows the homogeneous distribution of the alloying element in the joint that has been fabricated with the produced sintering paste. The porosity of the sintered layer is reduced by the addition of tin as alloying element which can improve the electrical and thermal properties as well.
AB - Current limitations of silver sintering are long processing times and high processing temperatures. To overcome these restrictions, different tin contents are added to the sintering paste. Various preheating times and processing times are evaluated at a processing temperature of 235°C. The positive effect of micro scale tin particles on shear strength and porosity at reduced process parameters is demonstrated. The addition of tin particles enables a reduction of both the processing temperature and time while maintaining high shear strengths. At a processing time of 60 s and no preheating time, the addition of 27.5 at% tin to the sintering paste leads to an increase in shear strength of 417 % from 4.6 MPa to 19.2 MPa, compared to the sintering paste without an alloying element. Energy-dispersive X-ray spectroscopy shows the homogeneous distribution of the alloying element in the joint that has been fabricated with the produced sintering paste. The porosity of the sintered layer is reduced by the addition of tin as alloying element which can improve the electrical and thermal properties as well.
KW - AgSn
KW - TLP
KW - shear strength
KW - silver sintering
UR - http://www.scopus.com/inward/record.url?scp=85168309694&partnerID=8YFLogxK
U2 - 10.1109/ectc51909.2023.00118
DO - 10.1109/ectc51909.2023.00118
M3 - Conference contribution
SN - 979-8-3503-3499-9
T3 - Proceedings - Electronic Components Conference
SP - 676
EP - 681
BT - 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
PB - Institute of Electrical and Electronics Engineers Inc.
ER -