Details
| Original language | English |
|---|---|
| Title of host publication | SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics |
| Editors | Rolf Brendel, Christophe Ballif, Sebastien Dubois, Stefan Glunz, Giso Hahn, Jef Poortmans, Pierre Verlinden, Arthur Weeber |
| Publisher | AIP Publishing LLC |
| Number of pages | 8 |
| ISBN (electronic) | 9780735443624 |
| Publication status | Published - 24 Aug 2022 |
| Event | 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021 - Hamelin, Virtual, Germany Duration: 19 Apr 2021 → 23 Apr 2021 |
Publication series
| Name | AIP Conference Proceedings |
|---|---|
| Volume | 2487 |
| ISSN (Print) | 0094-243X |
| ISSN (electronic) | 1551-7616 |
Abstract
Perovskite-on-silicon tandem solar cells are a promising candidate to significantly increase the efficiency of PV modules. Despite the fast research progress on material and solar cells aspects, there is still a lack of processes for an industrial module integration of these devices. One aspect hereby is the adaption of encapsulation materials and processes to the requirements of perovskite materials. Process temperatures of about 150 °C are necessary to use well proven, in silicon PV commonly applied encapsulation materials with a high reliability. However, perovskites start to decompose into their components at high temperatures. This limits the encapsulation process temperature, which in turn constraints the choice of encapsulation materials. This work presents an encapsulation process for methylammonium lead iodide (MAPhb) single junction perovskite solar cells (PSCs) with conventional production tools in glass-glass modules that serves as a model system for perovskite tandem applications. We evaluate the influence of the encapsulation process temperature between 120 °C and 160 °C on the performance of mini modules. The UV-absorbing encapsulation material is processable over the whole investigated temperature regime. We observe a difference in the IV-characteristics between the PSCs encapsulated in the temperature range of 120 °C - 140 °C to those processed at 160 °C. At lower encapsulation temperatures the IV-curves taken 1 h after encapsulation show a pronounced S-shape and no degradation of Foe. In contrast, the PSCs encapsulated at 160 °C exhibit a Foe decrease of up to 29% compared to the initial measurement shortly after PSC fabrication and no significant S-shape. Both, the S-shape that occurs at low encapsulation temperatures and the Foe loss after encapsulation at 160 °C, are no longer significant after one week of module storage under dark conditions. The presented encapsulation process therefore does not permanently damage the MAPbb PSCs even at a standard encapsulation temperature of 160 °C. To ensure long-term operation, we test the fabricated mini modules in a damp heat test at 85 °C and a relative humidity of 85%. We find no significant additional degradation caused by damp heat in 1250 h test duration compared to a reference module stored in ambient air.
ASJC Scopus subject areas
- Physics and Astronomy(all)
- General Physics and Astronomy
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SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics. ed. / Rolf Brendel; Christophe Ballif; Sebastien Dubois; Stefan Glunz; Giso Hahn; Jef Poortmans; Pierre Verlinden; Arthur Weeber. AIP Publishing LLC, 2022. 120001 (AIP Conference Proceedings; Vol. 2487).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Influence of Encapsulation Process Temperature on the Performance of Perovskite Mini Modules
AU - Baumann, Sara
AU - Brockmann, Lukas
AU - Blankemeyer, Susanne
AU - Steckenreiter, Verena
AU - Barnscheidt, Verena
AU - Köntges, Marc
AU - Kajari-Schröder, Sarah
AU - Wolter, Sascha Jozsef
AU - Schulte-Huxel, Henning
AU - Wietler, Tobias
N1 - Funding Information: Authors thank the German Federal Environmental Foundation (DBU), the state of Lower Saxony and the Federal Ministry for Economic Affairs and Energy (BMWi) under grant number 03EE1017B (P3T) for their funding and M. Diederich, M. Lohning, Y. Larionova, J. Strey and M. C. Turcu (all from ISFH) for PSC processing.
PY - 2022/8/24
Y1 - 2022/8/24
N2 - Perovskite-on-silicon tandem solar cells are a promising candidate to significantly increase the efficiency of PV modules. Despite the fast research progress on material and solar cells aspects, there is still a lack of processes for an industrial module integration of these devices. One aspect hereby is the adaption of encapsulation materials and processes to the requirements of perovskite materials. Process temperatures of about 150 °C are necessary to use well proven, in silicon PV commonly applied encapsulation materials with a high reliability. However, perovskites start to decompose into their components at high temperatures. This limits the encapsulation process temperature, which in turn constraints the choice of encapsulation materials. This work presents an encapsulation process for methylammonium lead iodide (MAPhb) single junction perovskite solar cells (PSCs) with conventional production tools in glass-glass modules that serves as a model system for perovskite tandem applications. We evaluate the influence of the encapsulation process temperature between 120 °C and 160 °C on the performance of mini modules. The UV-absorbing encapsulation material is processable over the whole investigated temperature regime. We observe a difference in the IV-characteristics between the PSCs encapsulated in the temperature range of 120 °C - 140 °C to those processed at 160 °C. At lower encapsulation temperatures the IV-curves taken 1 h after encapsulation show a pronounced S-shape and no degradation of Foe. In contrast, the PSCs encapsulated at 160 °C exhibit a Foe decrease of up to 29% compared to the initial measurement shortly after PSC fabrication and no significant S-shape. Both, the S-shape that occurs at low encapsulation temperatures and the Foe loss after encapsulation at 160 °C, are no longer significant after one week of module storage under dark conditions. The presented encapsulation process therefore does not permanently damage the MAPbb PSCs even at a standard encapsulation temperature of 160 °C. To ensure long-term operation, we test the fabricated mini modules in a damp heat test at 85 °C and a relative humidity of 85%. We find no significant additional degradation caused by damp heat in 1250 h test duration compared to a reference module stored in ambient air.
AB - Perovskite-on-silicon tandem solar cells are a promising candidate to significantly increase the efficiency of PV modules. Despite the fast research progress on material and solar cells aspects, there is still a lack of processes for an industrial module integration of these devices. One aspect hereby is the adaption of encapsulation materials and processes to the requirements of perovskite materials. Process temperatures of about 150 °C are necessary to use well proven, in silicon PV commonly applied encapsulation materials with a high reliability. However, perovskites start to decompose into their components at high temperatures. This limits the encapsulation process temperature, which in turn constraints the choice of encapsulation materials. This work presents an encapsulation process for methylammonium lead iodide (MAPhb) single junction perovskite solar cells (PSCs) with conventional production tools in glass-glass modules that serves as a model system for perovskite tandem applications. We evaluate the influence of the encapsulation process temperature between 120 °C and 160 °C on the performance of mini modules. The UV-absorbing encapsulation material is processable over the whole investigated temperature regime. We observe a difference in the IV-characteristics between the PSCs encapsulated in the temperature range of 120 °C - 140 °C to those processed at 160 °C. At lower encapsulation temperatures the IV-curves taken 1 h after encapsulation show a pronounced S-shape and no degradation of Foe. In contrast, the PSCs encapsulated at 160 °C exhibit a Foe decrease of up to 29% compared to the initial measurement shortly after PSC fabrication and no significant S-shape. Both, the S-shape that occurs at low encapsulation temperatures and the Foe loss after encapsulation at 160 °C, are no longer significant after one week of module storage under dark conditions. The presented encapsulation process therefore does not permanently damage the MAPbb PSCs even at a standard encapsulation temperature of 160 °C. To ensure long-term operation, we test the fabricated mini modules in a damp heat test at 85 °C and a relative humidity of 85%. We find no significant additional degradation caused by damp heat in 1250 h test duration compared to a reference module stored in ambient air.
UR - http://www.scopus.com/inward/record.url?scp=85137427148&partnerID=8YFLogxK
U2 - 10.1063/5.0090632
DO - 10.1063/5.0090632
M3 - Conference contribution
AN - SCOPUS:85137427148
T3 - AIP Conference Proceedings
BT - SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics
A2 - Brendel, Rolf
A2 - Ballif, Christophe
A2 - Dubois, Sebastien
A2 - Glunz, Stefan
A2 - Hahn, Giso
A2 - Poortmans, Jef
A2 - Verlinden, Pierre
A2 - Weeber, Arthur
PB - AIP Publishing LLC
T2 - 11th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2021
Y2 - 19 April 2021 through 23 April 2021
ER -