In situ cleaning of Si surfaces by UV/ozone

Research output: Contribution to journalArticleResearchpeer review

Authors

  • G. Lippert
  • H. J. Osten

External Research Organisations

  • Leibniz Institute for High Performance Microelectronics (IHP)
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Details

Original languageEnglish
Pages (from-to)476-478
Number of pages3
JournalJournal of crystal growth
Volume127
Issue number1-4
Publication statusPublished - 2 Feb 1993
Externally publishedYes

Abstract

We describe an attempt to perform the UV/ozone cleaning step for silicon wafers within the ultrahigh vacuum system. By introducing the UV/ozone cleaning into the load lock of the MBE equipment we avoid the contact of the normally ex situ UV/ozone precleaned substrate to air. In addition we gain a further degree of freedom, namely the oxygen partial pressure. The influence of that pressure on removing carbon-containing contaminations and on the properties of the in situ formed thin oxide layer is investigated by X-ray photoelectron spectroscopy (XPS) without breaking the vacuum.

ASJC Scopus subject areas

Cite this

In situ cleaning of Si surfaces by UV/ozone. / Lippert, G.; Osten, H. J.
In: Journal of crystal growth, Vol. 127, No. 1-4, 02.02.1993, p. 476-478.

Research output: Contribution to journalArticleResearchpeer review

Lippert G, Osten HJ. In situ cleaning of Si surfaces by UV/ozone. Journal of crystal growth. 1993 Feb 2;127(1-4):476-478. doi: 10.1016/0022-0248(93)90664-I
Lippert, G. ; Osten, H. J. / In situ cleaning of Si surfaces by UV/ozone. In: Journal of crystal growth. 1993 ; Vol. 127, No. 1-4. pp. 476-478.
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