Impact of PCB layout design on final product's EMI compliance

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Authors

  • Kye Yak See
  • Manish Oswal
  • Werachet Khan-Ngern
  • Flavio Canavero
  • Christos Christopoulos
  • Hartmut Grabinski

Research Organisations

External Research Organisations

  • Nanyang Technological University (NTU)
  • King Mongkut's Institute of Technology Ladkrabang
  • Politecnico di Torino (POLITO)
  • University of Nottingham
View graph of relations

Details

Original languageEnglish
Title of host publication17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Pages553-556
Number of pages4
Publication statusPublished - 2006
Event17th International Zurich Symposium on Electromagnetic Compatibility, 2006 - Singapur, Singapore
Duration: 27 Feb 2006 → 3 Mar 2006

Publication series

Name17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Volume2006

Abstract

Most design engineers still believe that with a good shielded enclosure, well-shielded cables and high-performance ferrite sleeves, EMI compliance will be a straight forward task. This paper demonstartes experimentally that a poor PCB layout can cause electronic product to fail EMI specification badly even with all these fixes.

ASJC Scopus subject areas

Cite this

Impact of PCB layout design on final product's EMI compliance. / See, Kye Yak; Oswal, Manish; Khan-Ngern, Werachet et al.
17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. p. 553-556 1629684 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; Vol. 2006).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

See, KY, Oswal, M, Khan-Ngern, W, Canavero, F, Christopoulos, C & Grabinski, H 2006, Impact of PCB layout design on final product's EMI compliance. in 17th International Zurich Symposium on Electromagnetic Compatibility, 2006., 1629684, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, vol. 2006, pp. 553-556, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, Singapur, Singapore, 27 Feb 2006. https://doi.org/10.1109/EMCZUR.2006.214994
See, K. Y., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C., & Grabinski, H. (2006). Impact of PCB layout design on final product's EMI compliance. In 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 (pp. 553-556). Article 1629684 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; Vol. 2006). https://doi.org/10.1109/EMCZUR.2006.214994
See KY, Oswal M, Khan-Ngern W, Canavero F, Christopoulos C, Grabinski H. Impact of PCB layout design on final product's EMI compliance. In 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. p. 553-556. 1629684. (17th International Zurich Symposium on Electromagnetic Compatibility, 2006). doi: 10.1109/EMCZUR.2006.214994
See, Kye Yak ; Oswal, Manish ; Khan-Ngern, Werachet et al. / Impact of PCB layout design on final product's EMI compliance. 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. pp. 553-556 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006).
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