Details
| Original language | English |
|---|---|
| Title of host publication | 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9781728160498 |
| ISBN (print) | 978-1-7281-6050-4 |
| Publication status | Published - 2020 |
| Event | 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 - Cracow, Poland Duration: 5 Jul 2020 → 8 Jul 2020 |
Abstract
QFNs are electric components that are producing a substantial amount of heat during operation due to significant power loss. Resulting elevated temperatures can lead to critical damage of the chip and the package which could cause a loss of functionality. Therefore, controlling the maximum temperature within the package is crucial. Using thermal vias embedded in the PCB underneath the QFN is a common approach to control the heat flow. In this paper a simulation approach is presented using 3D-Finite-Element-Modeling to identify the impact of influencing parameters on the temperature distribution within the package. First, a review about relevant literature is given. This paper differs from the available literature by looking more detailed in the 3D-modelling aspect of thermal via designs. It is focused on a simulation approach to determine the temperature distribution within the soldered component and the PCB. Therefore, the build-up of the model is explained and applied material properties are given. Results for the determined temperature distribution for the reference system are presented. Furthermore, geometrical parameters are varied to identify main influencing parameters.
ASJC Scopus subject areas
- Chemical Engineering(all)
- Fluid Flow and Transfer Processes
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Computational Mechanics
- Engineering(all)
- Mechanical Engineering
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Mathematics(all)
- Modelling and Simulation
Cite this
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9152651.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Identification of influencing PCB design parameters on thermal performance of a QFN package
AU - Hollstein, Kai
AU - Yang, Lintao
AU - Gao, Yuan
AU - Weide-Zaage, Kirsten
PY - 2020
Y1 - 2020
N2 - QFNs are electric components that are producing a substantial amount of heat during operation due to significant power loss. Resulting elevated temperatures can lead to critical damage of the chip and the package which could cause a loss of functionality. Therefore, controlling the maximum temperature within the package is crucial. Using thermal vias embedded in the PCB underneath the QFN is a common approach to control the heat flow. In this paper a simulation approach is presented using 3D-Finite-Element-Modeling to identify the impact of influencing parameters on the temperature distribution within the package. First, a review about relevant literature is given. This paper differs from the available literature by looking more detailed in the 3D-modelling aspect of thermal via designs. It is focused on a simulation approach to determine the temperature distribution within the soldered component and the PCB. Therefore, the build-up of the model is explained and applied material properties are given. Results for the determined temperature distribution for the reference system are presented. Furthermore, geometrical parameters are varied to identify main influencing parameters.
AB - QFNs are electric components that are producing a substantial amount of heat during operation due to significant power loss. Resulting elevated temperatures can lead to critical damage of the chip and the package which could cause a loss of functionality. Therefore, controlling the maximum temperature within the package is crucial. Using thermal vias embedded in the PCB underneath the QFN is a common approach to control the heat flow. In this paper a simulation approach is presented using 3D-Finite-Element-Modeling to identify the impact of influencing parameters on the temperature distribution within the package. First, a review about relevant literature is given. This paper differs from the available literature by looking more detailed in the 3D-modelling aspect of thermal via designs. It is focused on a simulation approach to determine the temperature distribution within the soldered component and the PCB. Therefore, the build-up of the model is explained and applied material properties are given. Results for the determined temperature distribution for the reference system are presented. Furthermore, geometrical parameters are varied to identify main influencing parameters.
UR - http://www.scopus.com/inward/record.url?scp=85090407151&partnerID=8YFLogxK
U2 - 10.1109/eurosime48426.2020.9152651
DO - 10.1109/eurosime48426.2020.9152651
M3 - Conference contribution
AN - SCOPUS:85090407151
SN - 978-1-7281-6050-4
BT - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
Y2 - 5 July 2020 through 8 July 2020
ER -