Details
| Original language | German |
|---|---|
| Publication status | Published - Feb 2015 |
| Event | SMTA Pan Pacific Microelectronics Symposium - Kauai, Hawaii, United States Duration: 2 Feb 2015 → 5 Feb 2015 |
Conference
| Conference | SMTA Pan Pacific Microelectronics Symposium |
|---|---|
| Country/Territory | United States |
| Period | 2 Feb 2015 → 5 Feb 2015 |
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Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects. / Wurz, Marc; Akin, Meriem; Rissing, Lutz et al.
2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
Research output: Contribution to conference › Paper › Research
Wurz, M, Akin, M, Rissing, L, Corea, J, Scott, S & Arias, AC 2015, 'Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects', Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States, 2 Feb 2015 - 5 Feb 2015. https://doi.org/10.13140/RG.2.1.2064.9763/1
Wurz, M., Akin, M., Rissing, L., Corea, J., Scott, S., & Arias, A. C. (2015). Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States. https://doi.org/10.13140/RG.2.1.2064.9763/1
Wurz M, Akin M, Rissing L, Corea J, Scott S, Arias AC. Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects. 2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States. doi: 10.13140/RG.2.1.2064.9763/1
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title = "Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects",
author = "Marc Wurz and Meriem Akin and Lutz Rissing and Joe Corea and Simon Scott and Arias, {Ana Claudia}",
year = "2015",
month = feb,
doi = "10.13140/RG.2.1.2064.9763/1",
language = "Deutsch",
note = "SMTA Pan Pacific Microelectronics Symposium ; Conference date: 02-02-2015 Through 05-02-2015",
}
Download
TY - CONF
T1 - Hybrid Packaging of Circuits and Devices Onto Flexible Screen Printed Electrical Interconnects
AU - Wurz, Marc
AU - Akin, Meriem
AU - Rissing, Lutz
AU - Corea, Joe
AU - Scott, Simon
AU - Arias, Ana Claudia
PY - 2015/2
Y1 - 2015/2
U2 - 10.13140/RG.2.1.2064.9763/1
DO - 10.13140/RG.2.1.2064.9763/1
M3 - Paper
T2 - SMTA Pan Pacific Microelectronics Symposium
Y2 - 2 February 2015 through 5 February 2015
ER -