High-efficiency cells from layer transfer: A first step toward thin-film/wafer hybrid silicon technologies

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Rolf Brendel
  • Jan Hendrik Petermann
  • Dimitri Zielke
  • Henning Schulte-Huxel
  • Michael Kessler
  • Sebastian Gatz
  • Stefan Eidelloth
  • Robert Bock
  • Enrique Garralaga Rojas
  • Jan Schmidt
  • Thorsten Dullweber

Research Organisations

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
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Details

Original languageEnglish
Article number6018975
Pages (from-to)9-15
Number of pages7
JournalIEEE journal of photovoltaics
Volume1
Issue number1
Publication statusPublished - 2011

Abstract

Future low-cost Si photovoltaics shall combine the high-efficiency potential of ultrathin monocrystalline Si films with the low cost per area of the Si-thin-film photovoltaics. The literature describes various techniques for fabricating ultrathin monocrystalline Si films with no need for sawing wafers. Layer transfer using epitaxy on porous Si and subsequent layer separation is one option. We demonstrate an independently confirmed aperture efficiency of 19.1 for a 4-cm 2-sized layer transfer cell with a thickness of 43μm. This cell has a passivated emitter and rear contact structure with an Al 2O 3-surface passivation by atomic layer deposition and lasered contact openings. Highly efficient thin crystalline solar cells have to be integrated into modules. We also report on laser bonding of Si cells to a metalized carrier for module integration.

Keywords

    Aluminum oxide passivation, laser bonding, layer transfer, thin film/wafer hybrid

ASJC Scopus subject areas

Cite this

High-efficiency cells from layer transfer: A first step toward thin-film/wafer hybrid silicon technologies. / Brendel, Rolf; Petermann, Jan Hendrik; Zielke, Dimitri et al.
In: IEEE journal of photovoltaics, Vol. 1, No. 1, 6018975, 2011, p. 9-15.

Research output: Contribution to journalArticleResearchpeer review

Brendel, R, Petermann, JH, Zielke, D, Schulte-Huxel, H, Kessler, M, Gatz, S, Eidelloth, S, Bock, R, Garralaga Rojas, E, Schmidt, J & Dullweber, T 2011, 'High-efficiency cells from layer transfer: A first step toward thin-film/wafer hybrid silicon technologies', IEEE journal of photovoltaics, vol. 1, no. 1, 6018975, pp. 9-15. https://doi.org/10.1109/JPHOTOV.2011.2165529
Brendel, R., Petermann, J. H., Zielke, D., Schulte-Huxel, H., Kessler, M., Gatz, S., Eidelloth, S., Bock, R., Garralaga Rojas, E., Schmidt, J., & Dullweber, T. (2011). High-efficiency cells from layer transfer: A first step toward thin-film/wafer hybrid silicon technologies. IEEE journal of photovoltaics, 1(1), 9-15. Article 6018975. https://doi.org/10.1109/JPHOTOV.2011.2165529
Brendel R, Petermann JH, Zielke D, Schulte-Huxel H, Kessler M, Gatz S et al. High-efficiency cells from layer transfer: A first step toward thin-film/wafer hybrid silicon technologies. IEEE journal of photovoltaics. 2011;1(1):9-15. 6018975. doi: 10.1109/JPHOTOV.2011.2165529
Brendel, Rolf ; Petermann, Jan Hendrik ; Zielke, Dimitri et al. / High-efficiency cells from layer transfer : A first step toward thin-film/wafer hybrid silicon technologies. In: IEEE journal of photovoltaics. 2011 ; Vol. 1, No. 1. pp. 9-15.
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abstract = "Future low-cost Si photovoltaics shall combine the high-efficiency potential of ultrathin monocrystalline Si films with the low cost per area of the Si-thin-film photovoltaics. The literature describes various techniques for fabricating ultrathin monocrystalline Si films with no need for sawing wafers. Layer transfer using epitaxy on porous Si and subsequent layer separation is one option. We demonstrate an independently confirmed aperture efficiency of 19.1 for a 4-cm 2-sized layer transfer cell with a thickness of 43μm. This cell has a passivated emitter and rear contact structure with an Al 2O 3-surface passivation by atomic layer deposition and lasered contact openings. Highly efficient thin crystalline solar cells have to be integrated into modules. We also report on laser bonding of Si cells to a metalized carrier for module integration.",
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