Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | IEEE 70th Electronic Components and Technology Conference, ECTC 2020 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 439-444 |
| Number of pages | 6 |
| ISBN (electronic) | 9781728161808 |
| ISBN (print) | 978-1-7281-6181-5 |
| Publication status | Published - 2020 |
| Event | 70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States Duration: 3 Jun 2020 → 30 Jun 2020 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2020-June |
| ISSN (Print) | 0569-5503 |
Abstract
This paper covers the successful manufacturing of Giant Magneto-Resistive (GMR) spin valve sensors consisting of a highly precise thin film stack of partially only three nanometer thin metal layers on the high-performant polymer polyether-ether-ketone (PEEK). By means of injection molding, disk-shaped wafer-like substrates were made including meandering cavities for subsequent sputter deposition. After a polishing step, a backside contact was established using the technique of laser direct structuring. The entire production process replaces and simplifies the classical lithography and masking processes almost rendering a clean room redundant. Sensors manufactured this way on PEEK substrate show a magneto-resistive effect of 3.7 % in comparison to 7.2 % for sensors gained with the same deposition parameters on silicon dioxide.
Keywords
- direct structuring, GMR, magneto-resistant sensor, PEEK, polycarbonate, polymer, spin valve, through-hole plating
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 439-444 9159426 (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Giant Magneto-Resistive Effect based Sensor on Laser Direct Structured MID Substrates
AU - Fischer, Eike Christian
AU - Bengsch, Sebastian
AU - De Wall, Sascha
AU - Wurz, Marc Christopher
PY - 2020
Y1 - 2020
N2 - This paper covers the successful manufacturing of Giant Magneto-Resistive (GMR) spin valve sensors consisting of a highly precise thin film stack of partially only three nanometer thin metal layers on the high-performant polymer polyether-ether-ketone (PEEK). By means of injection molding, disk-shaped wafer-like substrates were made including meandering cavities for subsequent sputter deposition. After a polishing step, a backside contact was established using the technique of laser direct structuring. The entire production process replaces and simplifies the classical lithography and masking processes almost rendering a clean room redundant. Sensors manufactured this way on PEEK substrate show a magneto-resistive effect of 3.7 % in comparison to 7.2 % for sensors gained with the same deposition parameters on silicon dioxide.
AB - This paper covers the successful manufacturing of Giant Magneto-Resistive (GMR) spin valve sensors consisting of a highly precise thin film stack of partially only three nanometer thin metal layers on the high-performant polymer polyether-ether-ketone (PEEK). By means of injection molding, disk-shaped wafer-like substrates were made including meandering cavities for subsequent sputter deposition. After a polishing step, a backside contact was established using the technique of laser direct structuring. The entire production process replaces and simplifies the classical lithography and masking processes almost rendering a clean room redundant. Sensors manufactured this way on PEEK substrate show a magneto-resistive effect of 3.7 % in comparison to 7.2 % for sensors gained with the same deposition parameters on silicon dioxide.
KW - direct structuring
KW - GMR
KW - magneto-resistant sensor
KW - PEEK
KW - polycarbonate
KW - polymer
KW - spin valve
KW - through-hole plating
UR - http://www.scopus.com/inward/record.url?scp=85090275348&partnerID=8YFLogxK
U2 - 10.1109/ECTC32862.2020.00077
DO - 10.1109/ECTC32862.2020.00077
M3 - Conference contribution
AN - SCOPUS:85090275348
SN - 978-1-7281-6181-5
T3 - Proceedings - Electronic Components and Technology Conference
SP - 439
EP - 444
BT - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 70th IEEE Electronic Components and Technology Conference, ECTC 2020
Y2 - 3 June 2020 through 30 June 2020
ER -