Formation of locally aluminum-doped p-type silicon regions by in-line high-rate evaporation

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Christoph Mader
  • Robert Bock
  • Jens Müller
  • Jan Schmidt
  • Rolf Brendel

Research Organisations

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
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Details

Original languageEnglish
Pages (from-to)521-526
Number of pages6
JournalEnergy Procedia
Volume8
Publication statusPublished - 2011

Abstract

Locally aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on locally laser-ablated Al2O3 / SiNx passivation layers. Due to the high substrate temperature of up to 778°C during deposition an Al-doped p+ region is formed. Using the camera-based dynamic infrared lifetime mapping technique we determine a contact recombination velocity of 1000 ± 100 cm/s for local Al-p+ regions on p-type silicon wafers of 1.5 ωcm resistivity. The recombination velocity between the contacts is determined to 4.4 ± 0.5 cm/s after deposition.

Keywords

    Alloying, Aluminum doped silicon, Crystalline silicon solar cell, In-line evaporation, Local contacts

ASJC Scopus subject areas

Cite this

Formation of locally aluminum-doped p-type silicon regions by in-line high-rate evaporation. / Mader, Christoph; Bock, Robert; Müller, Jens et al.
In: Energy Procedia, Vol. 8, 2011, p. 521-526.

Research output: Contribution to journalArticleResearchpeer review

Mader C, Bock R, Müller J, Schmidt J, Brendel R. Formation of locally aluminum-doped p-type silicon regions by in-line high-rate evaporation. Energy Procedia. 2011;8:521-526. doi: 10.1016/j.egypro.2011.06.176
Mader, Christoph ; Bock, Robert ; Müller, Jens et al. / Formation of locally aluminum-doped p-type silicon regions by in-line high-rate evaporation. In: Energy Procedia. 2011 ; Vol. 8. pp. 521-526.
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abstract = "Locally aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on locally laser-ablated Al2O3 / SiNx passivation layers. Due to the high substrate temperature of up to 778°C during deposition an Al-doped p+ region is formed. Using the camera-based dynamic infrared lifetime mapping technique we determine a contact recombination velocity of 1000 ± 100 cm/s for local Al-p+ regions on p-type silicon wafers of 1.5 ωcm resistivity. The recombination velocity between the contacts is determined to 4.4 ± 0.5 cm/s after deposition.",
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Download

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T1 - Formation of locally aluminum-doped p-type silicon regions by in-line high-rate evaporation

AU - Mader, Christoph

AU - Bock, Robert

AU - Müller, Jens

AU - Schmidt, Jan

AU - Brendel, Rolf

N1 - Funding Information: This work is supported by the State of Lower Saxony.

PY - 2011

Y1 - 2011

N2 - Locally aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on locally laser-ablated Al2O3 / SiNx passivation layers. Due to the high substrate temperature of up to 778°C during deposition an Al-doped p+ region is formed. Using the camera-based dynamic infrared lifetime mapping technique we determine a contact recombination velocity of 1000 ± 100 cm/s for local Al-p+ regions on p-type silicon wafers of 1.5 ωcm resistivity. The recombination velocity between the contacts is determined to 4.4 ± 0.5 cm/s after deposition.

AB - Locally aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on locally laser-ablated Al2O3 / SiNx passivation layers. Due to the high substrate temperature of up to 778°C during deposition an Al-doped p+ region is formed. Using the camera-based dynamic infrared lifetime mapping technique we determine a contact recombination velocity of 1000 ± 100 cm/s for local Al-p+ regions on p-type silicon wafers of 1.5 ωcm resistivity. The recombination velocity between the contacts is determined to 4.4 ± 0.5 cm/s after deposition.

KW - Alloying

KW - Aluminum doped silicon

KW - Crystalline silicon solar cell

KW - In-line evaporation

KW - Local contacts

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U2 - 10.1016/j.egypro.2011.06.176

DO - 10.1016/j.egypro.2011.06.176

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VL - 8

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EP - 526

JO - Energy Procedia

JF - Energy Procedia

SN - 1876-6102

ER -

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