Formation of aluminum-oxygen complexes in highly aluminum-doped silicon

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Original languageEnglish
Article number105007
JournalSemiconductor Science and Technology
Volume25
Issue number10
Early online date9 Sept 2010
Publication statusPublished - Oct 2010
Externally publishedYes

Abstract

We show that the carrier lifetime in highly aluminum-doped silicon regions experiences a pronounced degradation during thermal treatment at temperatures above 850 °C. The defect formation is shown to be directly linked to the simultaneous presence of oxygen and aluminum and thus can be attributed to the formation of aluminum-oxygen complexes. Temperature-dependent measurements of the defect generation rate provide evidence that the formation of the Al-O complex is thermally activated with an activation energy of 0.25 ± 0.08 eV.

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Formation of aluminum-oxygen complexes in highly aluminum-doped silicon. / Bock, Robert; Altermatt, Pietro P.; Schmidt, Jan et al.
In: Semiconductor Science and Technology, Vol. 25, No. 10, 105007, 10.2010.

Research output: Contribution to journalArticleResearchpeer review

Bock R, Altermatt PP, Schmidt J, Brendel R. Formation of aluminum-oxygen complexes in highly aluminum-doped silicon. Semiconductor Science and Technology. 2010 Oct;25(10):105007. Epub 2010 Sept 9. doi: 10.1088/0268-1242/25/10/105007
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