Details
| Original language | English |
|---|---|
| Title of host publication | Novel Optical Systems, Methods, and Applications XXIV |
| Editors | Cornelius F. Hahlweg, Joseph R. Mulley |
| Publisher | SPIE |
| ISBN (electronic) | 9781510644687 |
| Publication status | Published - 2021 |
| Event | Novel Optical Systems, Methods, and Applications XXIV 2021 - San Diego, United States Duration: 1 Aug 2021 → 5 Aug 2021 Conference number: 24 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Volume | 11815 |
| ISSN (Print) | 0277-786X |
| ISSN (electronic) | 1996-756X |
Abstract
While glass is an ideal material for optics, only a few microprocessing technologies are available. These technologies are usually limited regarding precision and freedom of design. A novel glass micromachining process is Laser Induced Deep Etching (LIDE). Without generating micro-cracks, introducing stress or other damages, it offers the possibility to precisely machine many types of glass. A broad range of features such as high-aspect ratio through holes, cutouts and slits in glass are available. In this work, LIDE is used to produce glass carrier substrates for integrated optical systems. Due to transmission characteristics and refractive index, the glass can be used as optical cladding for integrated polymer optical waveguides (refractive indices < 1.45). Cavities in glass, which can have different cross-sections e.g. u- or v-shaped, are filled with photoactive material by a doctor blade and function as an optical waveguide core. An additional approach examined in this work is the integration of optical fiber into v-shaped cavities. The system uses bare die laser diodes as transmitters and photo diodes as receivers bonded in front of the waveguide. LIDE technology allows to passively align the manufactured optical waveguide in front of the light source and detector due to mechanical features in the carrier substrate itself, eliminating the need for time-consuming and complex active alignment processes. This paper shows geometrical characteristics of waveguides and cavities, with a particular focus on surface roughness and subsequent filling ratio of the optical waveguide. Furthermore, the relative intensity distribution in the waveguide is presented and analyzed.
Keywords
- Laser structuring, Optical system, Optoelectronic packaging, Thin glass, Waveguide manufacturing
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Computer Science Applications
- Mathematics(all)
- Applied Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
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Novel Optical Systems, Methods, and Applications XXIV. ed. / Cornelius F. Hahlweg; Joseph R. Mulley. SPIE, 2021. 118150B (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11815).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Fabrication of an integrated optical system in glass using laser assisted manufacturing
AU - Reitz, B.
AU - Hoffmann, G. A.
AU - Gottwald, S. N.
AU - Overmeyer, L.
N1 - Conference code: 24
PY - 2021
Y1 - 2021
N2 - While glass is an ideal material for optics, only a few microprocessing technologies are available. These technologies are usually limited regarding precision and freedom of design. A novel glass micromachining process is Laser Induced Deep Etching (LIDE). Without generating micro-cracks, introducing stress or other damages, it offers the possibility to precisely machine many types of glass. A broad range of features such as high-aspect ratio through holes, cutouts and slits in glass are available. In this work, LIDE is used to produce glass carrier substrates for integrated optical systems. Due to transmission characteristics and refractive index, the glass can be used as optical cladding for integrated polymer optical waveguides (refractive indices < 1.45). Cavities in glass, which can have different cross-sections e.g. u- or v-shaped, are filled with photoactive material by a doctor blade and function as an optical waveguide core. An additional approach examined in this work is the integration of optical fiber into v-shaped cavities. The system uses bare die laser diodes as transmitters and photo diodes as receivers bonded in front of the waveguide. LIDE technology allows to passively align the manufactured optical waveguide in front of the light source and detector due to mechanical features in the carrier substrate itself, eliminating the need for time-consuming and complex active alignment processes. This paper shows geometrical characteristics of waveguides and cavities, with a particular focus on surface roughness and subsequent filling ratio of the optical waveguide. Furthermore, the relative intensity distribution in the waveguide is presented and analyzed.
AB - While glass is an ideal material for optics, only a few microprocessing technologies are available. These technologies are usually limited regarding precision and freedom of design. A novel glass micromachining process is Laser Induced Deep Etching (LIDE). Without generating micro-cracks, introducing stress or other damages, it offers the possibility to precisely machine many types of glass. A broad range of features such as high-aspect ratio through holes, cutouts and slits in glass are available. In this work, LIDE is used to produce glass carrier substrates for integrated optical systems. Due to transmission characteristics and refractive index, the glass can be used as optical cladding for integrated polymer optical waveguides (refractive indices < 1.45). Cavities in glass, which can have different cross-sections e.g. u- or v-shaped, are filled with photoactive material by a doctor blade and function as an optical waveguide core. An additional approach examined in this work is the integration of optical fiber into v-shaped cavities. The system uses bare die laser diodes as transmitters and photo diodes as receivers bonded in front of the waveguide. LIDE technology allows to passively align the manufactured optical waveguide in front of the light source and detector due to mechanical features in the carrier substrate itself, eliminating the need for time-consuming and complex active alignment processes. This paper shows geometrical characteristics of waveguides and cavities, with a particular focus on surface roughness and subsequent filling ratio of the optical waveguide. Furthermore, the relative intensity distribution in the waveguide is presented and analyzed.
KW - Laser structuring
KW - Optical system
KW - Optoelectronic packaging
KW - Thin glass
KW - Waveguide manufacturing
UR - http://www.scopus.com/inward/record.url?scp=85118102423&partnerID=8YFLogxK
U2 - 10.1117/12.2596376
DO - 10.1117/12.2596376
M3 - Conference contribution
AN - SCOPUS:85118102423
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Novel Optical Systems, Methods, and Applications XXIV
A2 - Hahlweg, Cornelius F.
A2 - Mulley, Joseph R.
PB - SPIE
T2 - Novel Optical Systems, Methods, and Applications XXIV 2021
Y2 - 1 August 2021 through 5 August 2021
ER -