Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach

Research output: Chapter in book/report/conference proceedingConference contributionResearch

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Original languageEnglish
Title of host publicationMikroSystemTechnik Kongress 2021
Subtitle of host publicationMikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings
PublisherVDE Verlag GmbH
Pages483-486
Number of pages4
ISBN (electronic)9783800756575
Publication statusPublished - 2021
EventMikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets - Stuttgart-Ludwigsburg, Germany
Duration: 8 Nov 202110 Nov 2021

Publication series

NameMikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings

Abstract

The high frequencies in GaN- or SiC-based switching devices allow for decreased component size reducing costs, weight and space. In case of transformers, this trend lead to the development of planar designs integrating the core in the circuit board and using the copper traces as windings. While showing good performance, these designs mostly suffer from high costs or complex technologies. The presented transformer on the other hand offers an intentionally simple design based on two-layer boards. The ferrite core is made from sheet material from DMEGC that is laser cut to create a customized shape and can be stacked to reach the desired inductance in the range of five to 25 µH. The transformer shows best results in a frequency range of 100 to 800 kHz with a resulting Q-factor of over 20 and a coupling coefficient of up to 98,5%.

ASJC Scopus subject areas

Cite this

Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. / Fischer, Eike Christian; Bierwirth, Tim Nils; Dencker, Folke et al.
MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 483-486 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearch

Fischer, EC, Bierwirth, TN, Dencker, F & Wurz, MC 2021, Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. in MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings, VDE Verlag GmbH, pp. 483-486, MikroSystemTechnik Congress 2021, Stuttgart-Ludwigsburg, Germany, 8 Nov 2021.
Fischer, E. C., Bierwirth, T. N., Dencker, F., & Wurz, M. C. (2021). Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. In MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings (pp. 483-486). (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings). VDE Verlag GmbH.
Fischer EC, Bierwirth TN, Dencker F, Wurz MC. Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. In MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH. 2021. p. 483-486. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
Fischer, Eike Christian ; Bierwirth, Tim Nils ; Dencker, Folke et al. / Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. pp. 483-486 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
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abstract = "The high frequencies in GaN- or SiC-based switching devices allow for decreased component size reducing costs, weight and space. In case of transformers, this trend lead to the development of planar designs integrating the core in the circuit board and using the copper traces as windings. While showing good performance, these designs mostly suffer from high costs or complex technologies. The presented transformer on the other hand offers an intentionally simple design based on two-layer boards. The ferrite core is made from sheet material from DMEGC that is laser cut to create a customized shape and can be stacked to reach the desired inductance in the range of five to 25 µH. The transformer shows best results in a frequency range of 100 to 800 kHz with a resulting Q-factor of over 20 and a coupling coefficient of up to 98,5%.",
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