Details
| Original language | English |
|---|---|
| Title of host publication | MikroSystemTechnik Kongress 2023 |
| Subtitle of host publication | Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 599-604 |
| Number of pages | 6 |
| ISBN (electronic) | 9783800762040 |
| Publication status | Published - Oct 2023 |
| Event | Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany Duration: 23 Oct 2023 → 25 Oct 2023 |
Abstract
The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Surfaces, Coatings and Films
- Physics and Astronomy(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
Cite this
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MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 599-604.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
}
TY - GEN
T1 - Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
AU - Bierwirth, Tim N.
AU - Fischer, Eike C.
AU - Prediger, Maren S.
AU - Le, Trong M.
AU - Dencker, Folke
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023/10
Y1 - 2023/10
N2 - The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.
AB - The rising demand for increasingly powerful hybrid and electric vehicles is driving the development of suitable charging technology. Here, the increase in switching frequency of over 500 kHz in GaN converters leads, among others, to a reduced core cross section for magnetic components. This reduced core cross section enables new fabrication methods for a planar integration. In this paper, a novel fabrication method for planar magnetics with a height of less than 2.5 mm is presented. A two-step injection molding process encapsulates multiple sintered ferrite cores simultaneously with poly-ether ether ketone (PEEK). The coils are produced on PEEK selectively by using a laser system and an electroless plating process. After the transformers are separated, they show an inductivity of up to 4.6 µH, which corresponds to an inductance density of 5.86 µH/cm2, and a coupling coefficient of 91 %. The less complicated winding process and the batch production of the molded interconnect device (MID) transformer allow higher production throughput compared to wire wound transformers.
UR - http://www.scopus.com/inward/record.url?scp=85196914869&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196914869
SP - 599
EP - 604
BT - MikroSystemTechnik Kongress 2023
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -