Experimentelle und numerische Untersuchung zum Langzeitkriechverhalten von Wärmedämmplatten aus extrudiertem Polystyrol-Hartschaumstoff: Herrn Univ.-Prof. em. Dr. Erich Cziesielski zum 75. Geburtstag gewidmet

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  • Nabil A. Fouad
  • Ehab F. Sadek

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Translated title of the contributionExperimental and fi nite element analysis of creep behavior of extruded polystyrene rigid foam
Original languageGerman
Pages (from-to)63-76
Number of pages14
JournalBAUPHYSIK
Volume35
Issue number2
Publication statusPublished - 4 Apr 2013

Abstract

Extruded polystyrene (XPS) rigid foams have recently attracted a great attention as a superior load-bearing thermal insulation material. This type of thermal insulation material is commonly used under raft foundations, where high levels of compression loads and sometimes shear loads take place. To apply these boards safely in such application areas, their creep behavior should be intensively evaluated and analyzed to avoid any hazardous potential settlement. The principle objective of the current research is to investigate the creep behavior of XPS load-bearing thermal insulation boards under pure shear and combined shear-compression stress states and to explore any potential effect the compression stresses could have on the shear creep strains under the combined loading state. Creep tests were performed on XPS rigid foam boards under shear and combined shear-compression stress states using a specially developed test set-up. Experimental results showed a slight increase in the creep shear strains due to the application of compression stresses in the combined loading conditions. Creep test results have been used to investigate the most accurate approach able to model and extrapolate the creep behavior under these types of stresses. An overview of simulating the creep behavior through finite element method using microstructure-based FE models was introduced. The microstructure was captured by the x-ray computer tomography imaging technique. The developed microstructure-based FE models were then used to carry out a parametric study aiming to optimize the creep response of XPS boards under shear and compression loads.

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@article{383bd73ccffe4eb28c905df195eb70a6,
title = "Experimentelle und numerische Untersuchung zum Langzeitkriechverhalten von W{\"a}rmed{\"a}mmplatten aus extrudiertem Polystyrol-Hartschaumstoff: Herrn Univ.-Prof. em. Dr. Erich Cziesielski zum 75. Geburtstag gewidmet",
abstract = "Extruded polystyrene (XPS) rigid foams have recently attracted a great attention as a superior load-bearing thermal insulation material. This type of thermal insulation material is commonly used under raft foundations, where high levels of compression loads and sometimes shear loads take place. To apply these boards safely in such application areas, their creep behavior should be intensively evaluated and analyzed to avoid any hazardous potential settlement. The principle objective of the current research is to investigate the creep behavior of XPS load-bearing thermal insulation boards under pure shear and combined shear-compression stress states and to explore any potential effect the compression stresses could have on the shear creep strains under the combined loading state. Creep tests were performed on XPS rigid foam boards under shear and combined shear-compression stress states using a specially developed test set-up. Experimental results showed a slight increase in the creep shear strains due to the application of compression stresses in the combined loading conditions. Creep test results have been used to investigate the most accurate approach able to model and extrapolate the creep behavior under these types of stresses. An overview of simulating the creep behavior through finite element method using microstructure-based FE models was introduced. The microstructure was captured by the x-ray computer tomography imaging technique. The developed microstructure-based FE models were then used to carry out a parametric study aiming to optimize the creep response of XPS boards under shear and compression loads.",
keywords = "Berechnungsverfahren - Calculation methods, Creep tests, Experimental set-up, Finite element model, Versuche - Experimental set-ups, W{\"a}rme - Thermal insulation and heat, X-ray computed tomography, XPS morphology",
author = "Fouad, {Nabil A.} and Sadek, {Ehab F.}",
note = "Copyright: Copyright 2013 Elsevier B.V., All rights reserved.",
year = "2013",
month = apr,
day = "4",
doi = "10.1002/bapi.201310057",
language = "Deutsch",
volume = "35",
pages = "63--76",
journal = "BAUPHYSIK",
issn = "0171-5445",
publisher = "John Wiley and Sons Ltd",
number = "2",

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TY - JOUR

T1 - Experimentelle und numerische Untersuchung zum Langzeitkriechverhalten von Wärmedämmplatten aus extrudiertem Polystyrol-Hartschaumstoff

T2 - Herrn Univ.-Prof. em. Dr. Erich Cziesielski zum 75. Geburtstag gewidmet

AU - Fouad, Nabil A.

AU - Sadek, Ehab F.

N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.

PY - 2013/4/4

Y1 - 2013/4/4

N2 - Extruded polystyrene (XPS) rigid foams have recently attracted a great attention as a superior load-bearing thermal insulation material. This type of thermal insulation material is commonly used under raft foundations, where high levels of compression loads and sometimes shear loads take place. To apply these boards safely in such application areas, their creep behavior should be intensively evaluated and analyzed to avoid any hazardous potential settlement. The principle objective of the current research is to investigate the creep behavior of XPS load-bearing thermal insulation boards under pure shear and combined shear-compression stress states and to explore any potential effect the compression stresses could have on the shear creep strains under the combined loading state. Creep tests were performed on XPS rigid foam boards under shear and combined shear-compression stress states using a specially developed test set-up. Experimental results showed a slight increase in the creep shear strains due to the application of compression stresses in the combined loading conditions. Creep test results have been used to investigate the most accurate approach able to model and extrapolate the creep behavior under these types of stresses. An overview of simulating the creep behavior through finite element method using microstructure-based FE models was introduced. The microstructure was captured by the x-ray computer tomography imaging technique. The developed microstructure-based FE models were then used to carry out a parametric study aiming to optimize the creep response of XPS boards under shear and compression loads.

AB - Extruded polystyrene (XPS) rigid foams have recently attracted a great attention as a superior load-bearing thermal insulation material. This type of thermal insulation material is commonly used under raft foundations, where high levels of compression loads and sometimes shear loads take place. To apply these boards safely in such application areas, their creep behavior should be intensively evaluated and analyzed to avoid any hazardous potential settlement. The principle objective of the current research is to investigate the creep behavior of XPS load-bearing thermal insulation boards under pure shear and combined shear-compression stress states and to explore any potential effect the compression stresses could have on the shear creep strains under the combined loading state. Creep tests were performed on XPS rigid foam boards under shear and combined shear-compression stress states using a specially developed test set-up. Experimental results showed a slight increase in the creep shear strains due to the application of compression stresses in the combined loading conditions. Creep test results have been used to investigate the most accurate approach able to model and extrapolate the creep behavior under these types of stresses. An overview of simulating the creep behavior through finite element method using microstructure-based FE models was introduced. The microstructure was captured by the x-ray computer tomography imaging technique. The developed microstructure-based FE models were then used to carry out a parametric study aiming to optimize the creep response of XPS boards under shear and compression loads.

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KW - Experimental set-up

KW - Finite element model

KW - Versuche - Experimental set-ups

KW - Wärme - Thermal insulation and heat

KW - X-ray computed tomography

KW - XPS morphology

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DO - 10.1002/bapi.201310057

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