Details
| Original language | English |
|---|---|
| Pages | 317-320 |
| Number of pages | 4 |
| Publication status | Published - 2001 |
| Event | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, United States Duration: 29 Oct 2001 → 31 Oct 2001 |
Conference
| Conference | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Cambridge |
| Period | 29 Oct 2001 → 31 Oct 2001 |
Abstract
We use a measurement method designed for coupled lines on highly conductive substrates to characterize identical asymmetric coupled lines fabricated on lossy silicon with and without a metallization plane beneath the two signal conductors. The study illustrates the important role of the return path in determining the electromagnetic coupling between the lines.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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2001. 317-320 Paper presented at IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Massachusetts, United States.
Research output: Contribution to conference › Paper › Research › peer review
}
TY - CONF
T1 - Experimental study of the ground plane in asymmetric coupled silicon lines
AU - Arz, Uwe
AU - Williams, Dylan F.
AU - Grabinski, Hartmut
PY - 2001
Y1 - 2001
N2 - We use a measurement method designed for coupled lines on highly conductive substrates to characterize identical asymmetric coupled lines fabricated on lossy silicon with and without a metallization plane beneath the two signal conductors. The study illustrates the important role of the return path in determining the electromagnetic coupling between the lines.
AB - We use a measurement method designed for coupled lines on highly conductive substrates to characterize identical asymmetric coupled lines fabricated on lossy silicon with and without a metallization plane beneath the two signal conductors. The study illustrates the important role of the return path in determining the electromagnetic coupling between the lines.
UR - http://www.scopus.com/inward/record.url?scp=0035699438&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2001.967672
DO - 10.1109/EPEP.2001.967672
M3 - Paper
AN - SCOPUS:0035699438
SP - 317
EP - 320
T2 - IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Y2 - 29 October 2001 through 31 October 2001
ER -