Details
| Original language | English |
|---|---|
| Pages (from-to) | 1977-1981 |
| Number of pages | 5 |
| Journal | Microelectronics reliability |
| Volume | 54 |
| Issue number | 9-10 |
| Publication status | Published - 1 Sept 2014 |
Abstract
For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction. Corner stress relief structures lower the influence of high thermo-mechanical stress. A high functional corner stress relief structure allows a more efficient chip design. In this work of corner stress relief structure is presented and an evaluation structure is shown which allows to prove the effectiveness of the stress relief.
Keywords
- Chip-package interaction, Corner stress relief structure, Deformation, Evaluation stress monitor, High robust metallization, Mechanical stress
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Physics and Astronomy(all)
- Condensed Matter Physics
- Materials Science(all)
- Surfaces, Coatings and Films
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microelectronics reliability, Vol. 54, No. 9-10, 01.09.2014, p. 1977-1981.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Evaluation new corner stress relief structure layout for high robust metallization
AU - Hein, V.
AU - Kludt, J.
AU - Weide-Zaage, K.
N1 - Publisher Copyright: © 2014 Elsevier Ltd. All rights reserved. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2014/9/1
Y1 - 2014/9/1
N2 - For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction. Corner stress relief structures lower the influence of high thermo-mechanical stress. A high functional corner stress relief structure allows a more efficient chip design. In this work of corner stress relief structure is presented and an evaluation structure is shown which allows to prove the effectiveness of the stress relief.
AB - For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction. Corner stress relief structures lower the influence of high thermo-mechanical stress. A high functional corner stress relief structure allows a more efficient chip design. In this work of corner stress relief structure is presented and an evaluation structure is shown which allows to prove the effectiveness of the stress relief.
KW - Chip-package interaction
KW - Corner stress relief structure
KW - Deformation
KW - Evaluation stress monitor
KW - High robust metallization
KW - Mechanical stress
UR - http://www.scopus.com/inward/record.url?scp=85028111302&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2014.07.039
DO - 10.1016/j.microrel.2014.07.039
M3 - Article
AN - SCOPUS:85028111302
VL - 54
SP - 1977
EP - 1981
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-10
ER -