Details
| Original language | English |
|---|---|
| Title of host publication | 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 |
| Publisher | IEEE Computer Society |
| ISBN (print) | 9781479947904 |
| Publication status | Published - 2014 |
| Event | 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 - Ghent, Belgium Duration: 7 Apr 2014 → 9 Apr 2014 |
Publication series
| Name | 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 |
|---|
Abstract
The main trends in consumer electronics are increasing performances of their products and a reduction of the costs. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and void formation due to electromigration (EM). Against this background copper pillar bumps were introduced, because they combine the robustness of metal wire bonds with the low bonding pressure of reflow soldering. Experimental results have shown a longer lifetime of Cu pillar bumps during EM tests, but a continuative analysis is still needed for design optimization. Against this background a finite element analysis (FEA) was performed to compare the EM induced mass flux in conventional solder bumps and in two different designs for Cu pillar bumps. The thermal electrical simulations were performed with ANSYS®. Afterwards a user routine was used to calculate the EM induced mass fluxes and mass flux divergences. The simulation results are used to identify possible reasons for the increased EM performance of Cu pillar bumps and they enable the identification of preferable designs.
ASJC Scopus subject areas
- Engineering(all)
- Control and Systems Engineering
- Engineering(all)
- Electrical and Electronic Engineering
- Mathematics(all)
- Modelling and Simulation
Cite this
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2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. IEEE Computer Society, 2014. 6813775 (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Electromigration reliability of cylindrical Cu pillar SnAg 3.0Cu0.5 bumps
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Goldbeck, B.
AU - Moujbani, A.
AU - Kludt, J.
AU - Fremont, H.
N1 - Copyright: Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - The main trends in consumer electronics are increasing performances of their products and a reduction of the costs. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and void formation due to electromigration (EM). Against this background copper pillar bumps were introduced, because they combine the robustness of metal wire bonds with the low bonding pressure of reflow soldering. Experimental results have shown a longer lifetime of Cu pillar bumps during EM tests, but a continuative analysis is still needed for design optimization. Against this background a finite element analysis (FEA) was performed to compare the EM induced mass flux in conventional solder bumps and in two different designs for Cu pillar bumps. The thermal electrical simulations were performed with ANSYS®. Afterwards a user routine was used to calculate the EM induced mass fluxes and mass flux divergences. The simulation results are used to identify possible reasons for the increased EM performance of Cu pillar bumps and they enable the identification of preferable designs.
AB - The main trends in consumer electronics are increasing performances of their products and a reduction of the costs. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and void formation due to electromigration (EM). Against this background copper pillar bumps were introduced, because they combine the robustness of metal wire bonds with the low bonding pressure of reflow soldering. Experimental results have shown a longer lifetime of Cu pillar bumps during EM tests, but a continuative analysis is still needed for design optimization. Against this background a finite element analysis (FEA) was performed to compare the EM induced mass flux in conventional solder bumps and in two different designs for Cu pillar bumps. The thermal electrical simulations were performed with ANSYS®. Afterwards a user routine was used to calculate the EM induced mass fluxes and mass flux divergences. The simulation results are used to identify possible reasons for the increased EM performance of Cu pillar bumps and they enable the identification of preferable designs.
UR - http://www.scopus.com/inward/record.url?scp=84901474925&partnerID=8YFLogxK
U2 - 10.1109/eurosime.2014.6813775
DO - 10.1109/eurosime.2014.6813775
M3 - Conference contribution
AN - SCOPUS:84901474925
SN - 9781479947904
T3 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
BT - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
PB - IEEE Computer Society
T2 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Y2 - 7 April 2014 through 9 April 2014
ER -