Details
| Original language | English |
|---|---|
| Article number | 110644 |
| Journal | Materials Characterization |
| Volume | 169 |
| Early online date | 16 Sept 2020 |
| Publication status | Published - Nov 2020 |
Abstract
The possibility to directly extrude semi-finished products using a solid-state-recycling process is a promising alternative to the remelting process, which is highly energy-intensive. Therefore, aluminium chips, normally considered as scrap, are used as the basis for the recycling. The recycling process consists of a cold compaction process, a field-assisted sintering (FAST) process to consolidate the chips, and finally a forward rod extrusion process. Compared to approaches which break the oxide layers by applying high shear stresses and deformations, necessary for an adequate welding of the chips, quasistatic and cyclic properties and capabilities are significantly increased. The defect structure of specimens, which was determined by means of computed tomography and which significantly influences the lifetime, could be correlated well with pre-test electrical resistance measurements. Finally, these findings were used to establish a lifetime calculation model based on unique electrical resistance measurements prior to mechanical testing.
Keywords
- Computed tomography, Fatigue behaviour, Lifetime prediction, Resistance measurements, Solid-state-recycling
ASJC Scopus subject areas
- Materials Science(all)
- General Materials Science
- Physics and Astronomy(all)
- Condensed Matter Physics
- Engineering(all)
- Mechanics of Materials
- Engineering(all)
- Mechanical Engineering
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
In: Materials Characterization, Vol. 169, 110644, 11.2020.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Electrical resistance-based fatigue assessment and capability prediction of extrudates from recycled field-assisted sintered EN AW-6082 aluminium chips
AU - Koch, Alexander
AU - Bonhage, Martin
AU - Teschke, Mirko
AU - Luecker, Lukas
AU - Behrens, Bernd Arno
AU - Walther, Frank
N1 - Funding Information: The development of defect volume determination by electrical resistance measurements and experimental setup is funded by the German Research Foundation (Deutsche Forschungsgemeinschaft, DFG) within the Collaborative Research Center CRC /Transregio 188 “Damage-Controlled Forming Processes” (subproject B01, project number 278868966 ).
PY - 2020/11
Y1 - 2020/11
N2 - The possibility to directly extrude semi-finished products using a solid-state-recycling process is a promising alternative to the remelting process, which is highly energy-intensive. Therefore, aluminium chips, normally considered as scrap, are used as the basis for the recycling. The recycling process consists of a cold compaction process, a field-assisted sintering (FAST) process to consolidate the chips, and finally a forward rod extrusion process. Compared to approaches which break the oxide layers by applying high shear stresses and deformations, necessary for an adequate welding of the chips, quasistatic and cyclic properties and capabilities are significantly increased. The defect structure of specimens, which was determined by means of computed tomography and which significantly influences the lifetime, could be correlated well with pre-test electrical resistance measurements. Finally, these findings were used to establish a lifetime calculation model based on unique electrical resistance measurements prior to mechanical testing.
AB - The possibility to directly extrude semi-finished products using a solid-state-recycling process is a promising alternative to the remelting process, which is highly energy-intensive. Therefore, aluminium chips, normally considered as scrap, are used as the basis for the recycling. The recycling process consists of a cold compaction process, a field-assisted sintering (FAST) process to consolidate the chips, and finally a forward rod extrusion process. Compared to approaches which break the oxide layers by applying high shear stresses and deformations, necessary for an adequate welding of the chips, quasistatic and cyclic properties and capabilities are significantly increased. The defect structure of specimens, which was determined by means of computed tomography and which significantly influences the lifetime, could be correlated well with pre-test electrical resistance measurements. Finally, these findings were used to establish a lifetime calculation model based on unique electrical resistance measurements prior to mechanical testing.
KW - Computed tomography
KW - Fatigue behaviour
KW - Lifetime prediction
KW - Resistance measurements
KW - Solid-state-recycling
UR - http://www.scopus.com/inward/record.url?scp=85091938847&partnerID=8YFLogxK
U2 - 10.1016/j.matchar.2020.110644
DO - 10.1016/j.matchar.2020.110644
M3 - Article
AN - SCOPUS:85091938847
VL - 169
JO - Materials Characterization
JF - Materials Characterization
SN - 1044-5803
M1 - 110644
ER -