Details
| Original language | English |
|---|---|
| Pages | 75-78 |
| Number of pages | 4 |
| Publication status | Published - 1999 |
| Event | 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, United States Duration: 25 Oct 1999 → 27 Oct 1999 |
Conference
| Conference | 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | San Diego |
| Period | 25 Oct 1999 → 27 Oct 1999 |
Abstract
In this work we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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1999. 75-78 Paper presented at 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging, San Diego, California, United States.
Research output: Contribution to conference › Paper › Research › peer review
}
TY - CONF
T1 - Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz
AU - Ktata, Faiez
AU - Arz, Uwe
AU - Grabinski, Hartmut
PY - 1999
Y1 - 1999
N2 - In this work we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
AB - In this work we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.
UR - http://www.scopus.com/inward/record.url?scp=0033350490&partnerID=8YFLogxK
U2 - 10.1109/EPEP.1999.819197
DO - 10.1109/EPEP.1999.819197
M3 - Paper
AN - SCOPUS:0033350490
SP - 75
EP - 78
T2 - 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging
Y2 - 25 October 1999 through 27 October 1999
ER -