Details
Translated title of the contribution | Application of copper and copper alloys in the microsystems technology |
---|---|
Original language | German |
Pages (from-to) | 504-506 |
Number of pages | 3 |
Journal | Metall |
Volume | 65 |
Issue number | 11 |
Publication status | Published - Nov 2011 |
ASJC Scopus subject areas
- Physics and Astronomy(all)
- Condensed Matter Physics
- Engineering(all)
- Mechanics of Materials
- Materials Science(all)
- Metals and Alloys
- Materials Science(all)
- Materials Chemistry
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In: Metall, Vol. 65, No. 11, 11.2011, p. 504-506.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Einsatz von kupfer und kupferlegierungen in der mikrosystemtechnik
AU - Wurz, M. C.
AU - Rissing, L.
PY - 2011/11
Y1 - 2011/11
UR - http://www.scopus.com/inward/record.url?scp=82055197291&partnerID=8YFLogxK
M3 - Artikel
AN - SCOPUS:82055197291
VL - 65
SP - 504
EP - 506
JO - Metall
JF - Metall
SN - 0026-0746
IS - 11
ER -