Details
| Original language | English |
|---|---|
| Pages (from-to) | 242-247 |
| Number of pages | 6 |
| Journal | Microelectronics reliability |
| Volume | 64 |
| Publication status | Published - 1 Sept 2016 |
Abstract
This paper starts with a bibliographic survey about solder corrosion and experimental results of the corrosion on lead-free solder balls during salt spray tests. Focus is made on the SnAgCu solder alloy. Ball Grid Array assemblies and “Package on Package” components were put up to 96 h in a salt spray chamber at 35 °C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard. The weight is measured during the test. The solder alloys are observed and analysed along the ageing with optical microscope and scanning electron microscope equipped with an energy-dispersive x-ray system. The solder alloy deterioration is visible after 48 h. The microstructure is analysed in order to determine the corroded residues found on the surface solder balls after the salt spray test. Tin oxychloride (Sn(OH)Cl) is found on BGA solder joints after reflow and on PoP solder balls before reflow. The size of the solder balls has an influence on the corrosion state. Finally a method is developed in order to measure the corrosion product growth on the same sample during the salt environment exposure.
Keywords
- Corrosion, Electronic assembly, Solder joints
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Physics and Astronomy(all)
- Condensed Matter Physics
- Materials Science(all)
- Surfaces, Coatings and Films
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microelectronics reliability, Vol. 64, 01.09.2016, p. 242-247.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Effects of salt spray test on lead-free solder alloy
AU - Guédon-Gracia, A.
AU - Frémont, H.
AU - Plano, B.
AU - Delétage, J. Y.
AU - Weide-Zaage, K.
N1 - Publisher Copyright: © 2016 Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2016/9/1
Y1 - 2016/9/1
N2 - This paper starts with a bibliographic survey about solder corrosion and experimental results of the corrosion on lead-free solder balls during salt spray tests. Focus is made on the SnAgCu solder alloy. Ball Grid Array assemblies and “Package on Package” components were put up to 96 h in a salt spray chamber at 35 °C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard. The weight is measured during the test. The solder alloys are observed and analysed along the ageing with optical microscope and scanning electron microscope equipped with an energy-dispersive x-ray system. The solder alloy deterioration is visible after 48 h. The microstructure is analysed in order to determine the corroded residues found on the surface solder balls after the salt spray test. Tin oxychloride (Sn(OH)Cl) is found on BGA solder joints after reflow and on PoP solder balls before reflow. The size of the solder balls has an influence on the corrosion state. Finally a method is developed in order to measure the corrosion product growth on the same sample during the salt environment exposure.
AB - This paper starts with a bibliographic survey about solder corrosion and experimental results of the corrosion on lead-free solder balls during salt spray tests. Focus is made on the SnAgCu solder alloy. Ball Grid Array assemblies and “Package on Package” components were put up to 96 h in a salt spray chamber at 35 °C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard. The weight is measured during the test. The solder alloys are observed and analysed along the ageing with optical microscope and scanning electron microscope equipped with an energy-dispersive x-ray system. The solder alloy deterioration is visible after 48 h. The microstructure is analysed in order to determine the corroded residues found on the surface solder balls after the salt spray test. Tin oxychloride (Sn(OH)Cl) is found on BGA solder joints after reflow and on PoP solder balls before reflow. The size of the solder balls has an influence on the corrosion state. Finally a method is developed in order to measure the corrosion product growth on the same sample during the salt environment exposure.
KW - Corrosion
KW - Electronic assembly
KW - Solder joints
UR - http://www.scopus.com/inward/record.url?scp=84991579834&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2016.07.034
DO - 10.1016/j.microrel.2016.07.034
M3 - Article
AN - SCOPUS:84991579834
VL - 64
SP - 242
EP - 247
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
ER -