Details
| Original language | English |
|---|---|
| Title of host publication | 2004 IEEE International Reliability Physics Symposium |
| Subtitle of host publication | Proceedings |
| Pages | 619-620 |
| Number of pages | 2 |
| Volume | 2004-January |
| Edition | January |
| Publication status | Published - 2004 |
| Event | 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004 - Phoenix, United States Duration: 25 Apr 2004 → 29 Apr 2004 |
Publication series
| Name | IEEE International Reliability Physics Symposium Proceedings |
|---|---|
| ISSN (Print) | 1541-7026 |
Abstract
The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
Keywords
- Electromigration, Fast thermal stressing, Power electronics, Thermomigration
ASJC Scopus subject areas
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2004 IEEE International Reliability Physics Symposium: Proceedings. Vol. 2004-January January. ed. 2004. p. 619-620 (IEEE International Reliability Physics Symposium Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Effect of thermal gradients on the electromigration life-time in power electronics
AU - Nguyen, H. V.
AU - Salm, C.
AU - Krabbenborg, B.
AU - Weide-Zaage, K.
AU - Bisschop, J.
AU - Mouthaan, A. J.
AU - Kuper, F. G.
N1 - Publisher Copyright: © 2004 IEEE. Copyright: Copyright 2015 Elsevier B.V., All rights reserved.
PY - 2004
Y1 - 2004
N2 - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
AB - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
KW - Electromigration
KW - Fast thermal stressing
KW - Power electronics
KW - Thermomigration
UR - http://www.scopus.com/inward/record.url?scp=84932102583&partnerID=8YFLogxK
U2 - 10.1109/RELPHY.2004.1315418
DO - 10.1109/RELPHY.2004.1315418
M3 - Conference contribution
AN - SCOPUS:84932102583
VL - 2004-January
T3 - IEEE International Reliability Physics Symposium Proceedings
SP - 619
EP - 620
BT - 2004 IEEE International Reliability Physics Symposium
T2 - 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004
Y2 - 25 April 2004 through 29 April 2004
ER -