Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Ye Larionova
  • N. P. Harder
  • R. Brendel

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
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Details

Original languageEnglish
Title of host publication35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010
Subtitle of host publicationConference Proceedings
Pages1207-1209
Number of pages3
Publication statusPublished - 2010
Event35th IEEE Photovoltaic Specialists Conference, PVSC 2010: PVSC 2010 - Honolulu, HI, United States
Duration: 20 Jun 201025 Jun 2010
Conference number: 35

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Abstract

The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

ASJC Scopus subject areas

Cite this

Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. / Larionova, Ye; Harder, N. P.; Brendel, R.
35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. p. 1207-1209 5614072 (Conference Record of the IEEE Photovoltaic Specialists Conference).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Larionova, Y, Harder, NP & Brendel, R 2010, Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. in 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings., 5614072, Conference Record of the IEEE Photovoltaic Specialists Conference, pp. 1207-1209, 35th IEEE Photovoltaic Specialists Conference, PVSC 2010, Honolulu, HI, United States, 20 Jun 2010. https://doi.org/10.1109/PVSC.2010.5614072
Larionova, Y., Harder, N. P., & Brendel, R. (2010). Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. In 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings (pp. 1207-1209). Article 5614072 (Conference Record of the IEEE Photovoltaic Specialists Conference). https://doi.org/10.1109/PVSC.2010.5614072
Larionova Y, Harder NP, Brendel R. Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. In 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. p. 1207-1209. 5614072. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC.2010.5614072
Larionova, Ye ; Harder, N. P. ; Brendel, R. / Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates. 35th IEEE Photovoltaic Specialists Conference Honolulu, HI, June 20-25, 2010: Conference Proceedings. 2010. pp. 1207-1209 (Conference Record of the IEEE Photovoltaic Specialists Conference).
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title = "Effect of SiO2 ticknesses in thermal-SiO2/PECVD-SiN stacks on surface passivation of n-Type Cz silicon substrates",
abstract = "The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.",
author = "Ye Larionova and Harder, {N. P.} and R. Brendel",
note = "Funding Information: The authors thank H. Kohlenberg for help with sample preparation. The financial support of this work by the state of Lower Saxony (Germany) is gratefully acknowledged.; 35th IEEE Photovoltaic Specialists Conference, PVSC 2010 ; Conference date: 20-06-2010 Through 25-06-2010",
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AU - Larionova, Ye

AU - Harder, N. P.

AU - Brendel, R.

N1 - Conference code: 35

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N2 - The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

AB - The influence of SiO2 thicknesses in thermal- SiO 2/PECVD-SiN stacks on surface passivation of 2.5 Ωcm n-type Czochralski silicon substrates has been investigated. By annealing theses stacks in air we achieve surface recombination velocities (SRV) better (i.e. lower) than 2.6 cm/s for thin SiO2 layers. We find a clear correlation between the thickness of the oxide layers and the annealing duration for obtaining optimum surface passivation. Furthermore, we also show that the absolute passivation quality of the SiO2/SiN stacks correlates to the SiO2thickness. We find that the SRV increases with increasing oxide thickness. We also present data of the surface passivation of these SiO 2/SiN stacks after storage in the dark for several months. We find a slight degradation of the surface passivation for thicker oxides and no observable degradation for the 10 nm thick SiO2 layer in our SiO 2/SiN stacks after 6 weeks of storage. Short annealing at 400°C in air restores the passivation quality and from then on remains unchanged for the measured storage time of 35 weeks.

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