Easy-to-use surface passivation technique for bulk carrier lifetime measurements on silicon wafers

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Original languageEnglish
Pages (from-to)259-263
Number of pages5
JournalProgress in Photovoltaics: Research and Applications
Volume6
Issue number4
Publication statusPublished - 21 Dec 1998
Externally publishedYes

Abstract

A novel, easily applicable surface passivation technique is presented, which, in combination with contactless photocoductance decay (PCD) measurements, allows a quick estimation of the bulk carrier lifetime of crystalline silicon wafers. The proposed passivation technique requires neither a chemical pre-cleaning of the silicon wafer nor expensive instrumentation. On both surfaces of the wafer a thin varnish film is deposited using a spinner. Subsequently, both surfaces of the coated silicon wafer are charged by means of a corona chamber. Using microwave-detected PCD measurements, we experimentally demonstrate that this novel surface passivation scheme provides differential surface recombination velocities in the 30-70 cm s-1 range on p-as well as n-type silicon wafers.

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Easy-to-use surface passivation technique for bulk carrier lifetime measurements on silicon wafers. / Schmidt, Jan; Aberle, Armin G.
In: Progress in Photovoltaics: Research and Applications, Vol. 6, No. 4, 21.12.1998, p. 259-263.

Research output: Contribution to journalArticleResearchpeer review

Schmidt J, Aberle AG. Easy-to-use surface passivation technique for bulk carrier lifetime measurements on silicon wafers. Progress in Photovoltaics: Research and Applications. 1998 Dec 21;6(4):259-263. doi: 10.1002/(SICI)1099-159X(199807/08)6:4<259::AID-PIP215>3.0.CO;2-Z
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