Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009 |
| Editors | Hendrik Van Brussel, Theresa Burke, H. Spaan, E. Brinksmeier, Theresa Burke, Theresa Burke |
| Pages | 146-149 |
| Number of pages | 4 |
| ISBN (electronic) | 9780955308260 |
| Publication status | Published - 1 Jan 2009 |
| Event | 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009 - San Sebastian, Spain Duration: 2 Jun 2009 → 5 Jun 2009 |
Publication series
| Name | Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009 |
|---|---|
| Volume | 2 |
Abstract
Metallic bonded multilayered grinding wheels offer high potential for low part shape tolerances in micro machining due to their low wear and high profile retention. The main problem is the dressing technology for those tools. A promising technique is the electro contact discharge dressing (ECDD), which is so far only able to generate simple profiles due to the size of the electrode. However, the size of the electrode can be reduced to a thin copper wire electrode to enable the generation of more complex or multi profiles, which is presented in this paper.
ASJC Scopus subject areas
- Engineering(all)
- Industrial and Manufacturing Engineering
- Physics and Astronomy(all)
- Instrumentation
- Engineering(all)
- Mechanical Engineering
- Materials Science(all)
- General Materials Science
- Environmental Science(all)
- Environmental Engineering
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Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009. ed. / Hendrik Van Brussel; Theresa Burke; H. Spaan; E. Brinksmeier; Theresa Burke; Theresa Burke. 2009. p. 146-149 (Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009; Vol. 2).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Dressing of micro profiles by wire electro discharge dressing
AU - Denkena, B.
AU - De Leon, L.
AU - Hahmann, D.
PY - 2009/1/1
Y1 - 2009/1/1
N2 - Metallic bonded multilayered grinding wheels offer high potential for low part shape tolerances in micro machining due to their low wear and high profile retention. The main problem is the dressing technology for those tools. A promising technique is the electro contact discharge dressing (ECDD), which is so far only able to generate simple profiles due to the size of the electrode. However, the size of the electrode can be reduced to a thin copper wire electrode to enable the generation of more complex or multi profiles, which is presented in this paper.
AB - Metallic bonded multilayered grinding wheels offer high potential for low part shape tolerances in micro machining due to their low wear and high profile retention. The main problem is the dressing technology for those tools. A promising technique is the electro contact discharge dressing (ECDD), which is so far only able to generate simple profiles due to the size of the electrode. However, the size of the electrode can be reduced to a thin copper wire electrode to enable the generation of more complex or multi profiles, which is presented in this paper.
UR - http://www.scopus.com/inward/record.url?scp=84884359363&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84884359363
T3 - Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009
SP - 146
EP - 149
BT - Proceedings of the 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009
A2 - Van Brussel, Hendrik
A2 - Burke, Theresa
A2 - Spaan, H.
A2 - Brinksmeier, E.
A2 - Burke, Theresa
A2 - Burke, Theresa
T2 - 9th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2009
Y2 - 2 June 2009 through 5 June 2009
ER -