Dopant diffusion from p + -poly-Si into c-Si during thermal annealing

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Jan Krugener
  • Yevgeniya Larionova
  • Dominic Tetzlaff
  • Bettina Wolpensinger
  • Sina Reiter
  • Mircea Turcu
  • Robby Peibst
  • Jan Dirk Kahler
  • Tobias Wietler

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
  • Centrotherm International AG
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Details

Original languageEnglish
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1140-1142
Number of pages3
ISBN (electronic)9781509056057
Publication statusPublished - 2017
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: 25 Jun 201730 Jun 2017

Abstract

Passivating junctions, like hole-collecting p-polycrystalline silicon/SiO x /crystalline silicon junctions, need a thermal activation to activate their excellent passivation and contact properties. Here, the diffusion of boron from the highly doped poly-Si layer into the Si is often considered to compromise the passivation quality. In contrast we show that at least a slight diffusion of boron into the crystalline silicon is present for optimized annealing conditions. We achieve low emitter saturation current densities of 11 fA/cm 2 for in situ p + doped polysilicon deposited by low pressure chemical vapor deposition. Furthermore, we show that the polysilicon layer and the in- diffused region within the substrate are electrically connected.

Keywords

    Diffusion, Junction formation, Low pressure chemical vapor deposition, Passivating contacts, Scanning electron microscopy

ASJC Scopus subject areas

Sustainable Development Goals

Cite this

Dopant diffusion from p + -poly-Si into c-Si during thermal annealing. / Krugener, Jan; Larionova, Yevgeniya; Tetzlaff, Dominic et al.
2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1140-1142.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Krugener, J, Larionova, Y, Tetzlaff, D, Wolpensinger, B, Reiter, S, Turcu, M, Peibst, R, Kahler, JD & Wietler, T 2017, Dopant diffusion from p + -poly-Si into c-Si during thermal annealing. in 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 1140-1142, 44th IEEE Photovoltaic Specialist Conference, PVSC 2017, Washington, United States, 25 Jun 2017. https://doi.org/10.1109/pvsc.2017.8366566
Krugener, J., Larionova, Y., Tetzlaff, D., Wolpensinger, B., Reiter, S., Turcu, M., Peibst, R., Kahler, J. D., & Wietler, T. (2017). Dopant diffusion from p + -poly-Si into c-Si during thermal annealing. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017 (pp. 1140-1142). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/pvsc.2017.8366566
Krugener J, Larionova Y, Tetzlaff D, Wolpensinger B, Reiter S, Turcu M et al. Dopant diffusion from p + -poly-Si into c-Si during thermal annealing. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1140-1142 doi: 10.1109/pvsc.2017.8366566
Krugener, Jan ; Larionova, Yevgeniya ; Tetzlaff, Dominic et al. / Dopant diffusion from p + -poly-Si into c-Si during thermal annealing. 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1140-1142
Download
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title = "Dopant diffusion from p + -poly-Si into c-Si during thermal annealing",
abstract = " Passivating junctions, like hole-collecting p-polycrystalline silicon/SiO x /crystalline silicon junctions, need a thermal activation to activate their excellent passivation and contact properties. Here, the diffusion of boron from the highly doped poly-Si layer into the Si is often considered to compromise the passivation quality. In contrast we show that at least a slight diffusion of boron into the crystalline silicon is present for optimized annealing conditions. We achieve low emitter saturation current densities of 11 fA/cm 2 for in situ p + doped polysilicon deposited by low pressure chemical vapor deposition. Furthermore, we show that the polysilicon layer and the in- diffused region within the substrate are electrically connected. ",
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AU - Krugener, Jan

AU - Larionova, Yevgeniya

AU - Tetzlaff, Dominic

AU - Wolpensinger, Bettina

AU - Reiter, Sina

AU - Turcu, Mircea

AU - Peibst, Robby

AU - Kahler, Jan Dirk

AU - Wietler, Tobias

N1 - Funding information: This work was supported by the German Federal Ministry for Economic Affairs and Energy (BMWi) under contract no. 0325702B. Furthermore we would like to thank Uwe Höhne, Guido Glowatzki, Bianca Gehring and Renate Winter for sample processing.

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AB - Passivating junctions, like hole-collecting p-polycrystalline silicon/SiO x /crystalline silicon junctions, need a thermal activation to activate their excellent passivation and contact properties. Here, the diffusion of boron from the highly doped poly-Si layer into the Si is often considered to compromise the passivation quality. In contrast we show that at least a slight diffusion of boron into the crystalline silicon is present for optimized annealing conditions. We achieve low emitter saturation current densities of 11 fA/cm 2 for in situ p + doped polysilicon deposited by low pressure chemical vapor deposition. Furthermore, we show that the polysilicon layer and the in- diffused region within the substrate are electrically connected.

KW - Diffusion

KW - Junction formation

KW - Low pressure chemical vapor deposition

KW - Passivating contacts

KW - Scanning electron microscopy

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