Dopant diffusion control by adding carbon into Si and SiGe: Principles and device application

Research output: Contribution to journalArticleResearchpeer review

Authors

  • H. J. Osten
  • D. Knoll
  • H. Rücker

External Research Organisations

  • Leibniz Institute for High Performance Microelectronics (IHP)
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Details

Original languageEnglish
Pages (from-to)262-270
Number of pages9
JournalMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Volume87
Issue number3
Early online date22 Oct 2001
Publication statusPublished - 19 Dec 2001
Externally publishedYes

Abstract

The incorporation of low concentrations of carbon (<1020 cm-3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the-art SiGe HBTs. Carbon also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

Keywords

    Bipolar transistor, Carbon, Diffusion, Heterojunction, Implantation, Silicon/Germanium

ASJC Scopus subject areas

Cite this

Dopant diffusion control by adding carbon into Si and SiGe: Principles and device application. / Osten, H. J.; Knoll, D.; Rücker, H.
In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol. 87, No. 3, 19.12.2001, p. 262-270.

Research output: Contribution to journalArticleResearchpeer review

Download
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AU - Osten, H. J.

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AU - Rücker, H.

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