Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 |
| Pages | 101-102 |
| Number of pages | 2 |
| ISBN (electronic) | 9780995775107 |
| Publication status | Published - 2017 |
| Event | 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 - Hannover, Germany Duration: 29 May 2017 → 2 Jun 2017 |
Publication series
| Name | Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 |
|---|
Abstract
The dicing of microsystems is an essential part of the batch production of MEMS. For this purpose, various methods have been developed, improved and integrated into a highly productive process. The future challenges of the batch manufacturing in this part are the 3-D integration of individual chips, the increasing diameter of the substrates and the associated wafer thickness. The establishment of 12″ and 18″ substrates into MEMS production bring new challenges to all currently used separation manufacturing processes. In this work the established separation process of dicing is evolved. Here, a "Crack-and-Fracture" method for silicon and borosilicate glass (Pyrex®) is examined. The work shows a novel process for backside chipping-free separation of silicon and glass substrates for MEMS. A theoretical coupling between "Crack-and-Fracture" and the stress intensity factor/crack propagation via the "Paris-Erdogan" law is determined. The area of linear expansion cracks is the active process mode of this method. In order to avoid the areas of subcritical crack growth (no separation) and overcritical crack growth (backside chipping), a high process understanding/control is needed.
Keywords
- Borosilicate, Crack propagation, Dicing, Separation, Silicon
ASJC Scopus subject areas
- Materials Science(all)
- General Materials Science
- Engineering(all)
- Mechanical Engineering
- Physics and Astronomy(all)
- Instrumentation
- Engineering(all)
- Industrial and Manufacturing Engineering
- Environmental Science(all)
- Environmental Engineering
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Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. 2017. p. 101-102 (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Dicing by "Crack-and-Fracture"
T2 - 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
AU - Stompe, Manuel
AU - Wurz, Marc Christopher
N1 - Copyright: Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2017
Y1 - 2017
N2 - The dicing of microsystems is an essential part of the batch production of MEMS. For this purpose, various methods have been developed, improved and integrated into a highly productive process. The future challenges of the batch manufacturing in this part are the 3-D integration of individual chips, the increasing diameter of the substrates and the associated wafer thickness. The establishment of 12″ and 18″ substrates into MEMS production bring new challenges to all currently used separation manufacturing processes. In this work the established separation process of dicing is evolved. Here, a "Crack-and-Fracture" method for silicon and borosilicate glass (Pyrex®) is examined. The work shows a novel process for backside chipping-free separation of silicon and glass substrates for MEMS. A theoretical coupling between "Crack-and-Fracture" and the stress intensity factor/crack propagation via the "Paris-Erdogan" law is determined. The area of linear expansion cracks is the active process mode of this method. In order to avoid the areas of subcritical crack growth (no separation) and overcritical crack growth (backside chipping), a high process understanding/control is needed.
AB - The dicing of microsystems is an essential part of the batch production of MEMS. For this purpose, various methods have been developed, improved and integrated into a highly productive process. The future challenges of the batch manufacturing in this part are the 3-D integration of individual chips, the increasing diameter of the substrates and the associated wafer thickness. The establishment of 12″ and 18″ substrates into MEMS production bring new challenges to all currently used separation manufacturing processes. In this work the established separation process of dicing is evolved. Here, a "Crack-and-Fracture" method for silicon and borosilicate glass (Pyrex®) is examined. The work shows a novel process for backside chipping-free separation of silicon and glass substrates for MEMS. A theoretical coupling between "Crack-and-Fracture" and the stress intensity factor/crack propagation via the "Paris-Erdogan" law is determined. The area of linear expansion cracks is the active process mode of this method. In order to avoid the areas of subcritical crack growth (no separation) and overcritical crack growth (backside chipping), a high process understanding/control is needed.
KW - Borosilicate
KW - Crack propagation
KW - Dicing
KW - Separation
KW - Silicon
UR - http://www.scopus.com/inward/record.url?scp=85041361956&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85041361956
T3 - Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
SP - 101
EP - 102
BT - Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
Y2 - 29 May 2017 through 2 June 2017
ER -