Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics

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Original languageEnglish
Title of host publicationMikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PublisherVDE Verlag GmbH
Pages113-116
Number of pages4
ISBN (electronic)9783800762040
Publication statusPublished - 2023
EventTechnology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany
Duration: 23 Oct 202325 Oct 2023

Publication series

NameMikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings

Abstract

Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.

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Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics. / Hadeler, Steffen; Vogt, Fabian; Wurz, Marc Christopher.
MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 113-116 (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Hadeler, S, Vogt, F & Wurz, MC 2023, Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics. in MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings, VDE Verlag GmbH, pp. 113-116, Technology Congress 2023, Dresden, Germany, 23 Oct 2023.
Hadeler, S., Vogt, F., & Wurz, M. C. (2023). Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics. In MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings (pp. 113-116). (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings). VDE Verlag GmbH.
Hadeler S, Vogt F, Wurz MC. Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics. In MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH. 2023. p. 113-116. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).
Hadeler, Steffen ; Vogt, Fabian ; Wurz, Marc Christopher. / Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics. MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. pp. 113-116 (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).
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abstract = "Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.",
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AU - Hadeler, Steffen

AU - Vogt, Fabian

AU - Wurz, Marc Christopher

N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.

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AB - Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.

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