Details
Original language | English |
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Title of host publication | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
Publisher | VDE Verlag GmbH |
Pages | 113-116 |
Number of pages | 4 |
ISBN (electronic) | 9783800762040 |
Publication status | Published - 2023 |
Event | Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany Duration: 23 Oct 2023 → 25 Oct 2023 |
Publication series
Name | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
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Abstract
Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Surfaces, Coatings and Films
- Physics and Astronomy(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. p. 113-116 (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics
AU - Hadeler, Steffen
AU - Vogt, Fabian
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.
AB - Condition monitoring using sensors is relevant for many technological components made of various materials. In this context, the interest on carbon fibre reinforced plastics (CFRP) increases. Existing measurement methods usually allow only indirect measurement or the integrated sensor represents a defect in the layer structure. This paper presents a new approach for the integration of sensors into CFRP. This approach is based on thin-film coating of a water-soluble substrate, transfer to CFRP, dissolution of the transfer substrate with water and embedding in further layers of CFRP. High adhesion of the transferred coatings has been demonstrated. The conductivity of the transferred coatings is not influenced by the embedding in further layers of CFRP. A fabricated strain gauge sensor structure showed a change in resistance as a function of applied strain. When the sensor was stretched by 1.75 mm, the resistance increased by 2 Ω. When the strain was removed, the measured resistance returned to its original value.
UR - http://www.scopus.com/inward/record.url?scp=85196916171&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196916171
T3 - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
SP - 113
EP - 116
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -