Details
| Original language | English |
|---|---|
| Article number | 111694 |
| Journal | Microelectronic engineering |
| Volume | 254 |
| Early online date | 24 Dec 2021 |
| Publication status | Published - 1 Feb 2022 |
Abstract
LED system design is often limited by the thermal performance of the system. Increased temperatures can cause a decrease in optical performance and can lower the overall reliability of the system. Therefore, proper thermal management and design is crucial for the device performance. Accurately measuring the junction temperature of a LED die is a complicated task. This paper is focusing on the application of micro-thermography for measuring the resulting surface temperature of a bare die bonded on a PCB substrate. First, relevant literature about thermal management of LED systems and standard approaches for junction temperature measurements are given. Then, the thermography system is introduced, and the implementation of the measurement procedure is discussed. The emissivity correction is an important part of the calibration of the system and is described in detail. A thorough thermal analysis has been conducted using the novel micro-thermography approach and the results are used for determining the thermal resistance of the system under analysis. Furthermore, a thermal simulation has been conducted using Finite Element Modeling. The model and meshing are described, and initial simulation results are given. The experimental data is then used to modify the thermal simulation model to accurately represent the thermal behavior of the system.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Physics and Astronomy(all)
- Condensed Matter Physics
- Materials Science(all)
- Surfaces, Coatings and Films
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microelectronic engineering, Vol. 254, 111694, 01.02.2022.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Developing a micro-thermography system for thermal characterization of LED packages
AU - Hollstein, K.
AU - Entholzner, D.
AU - Zhu, G.
AU - Weide-Zaage, K.
AU - Benstetter, G.
PY - 2022/2/1
Y1 - 2022/2/1
N2 - LED system design is often limited by the thermal performance of the system. Increased temperatures can cause a decrease in optical performance and can lower the overall reliability of the system. Therefore, proper thermal management and design is crucial for the device performance. Accurately measuring the junction temperature of a LED die is a complicated task. This paper is focusing on the application of micro-thermography for measuring the resulting surface temperature of a bare die bonded on a PCB substrate. First, relevant literature about thermal management of LED systems and standard approaches for junction temperature measurements are given. Then, the thermography system is introduced, and the implementation of the measurement procedure is discussed. The emissivity correction is an important part of the calibration of the system and is described in detail. A thorough thermal analysis has been conducted using the novel micro-thermography approach and the results are used for determining the thermal resistance of the system under analysis. Furthermore, a thermal simulation has been conducted using Finite Element Modeling. The model and meshing are described, and initial simulation results are given. The experimental data is then used to modify the thermal simulation model to accurately represent the thermal behavior of the system.
AB - LED system design is often limited by the thermal performance of the system. Increased temperatures can cause a decrease in optical performance and can lower the overall reliability of the system. Therefore, proper thermal management and design is crucial for the device performance. Accurately measuring the junction temperature of a LED die is a complicated task. This paper is focusing on the application of micro-thermography for measuring the resulting surface temperature of a bare die bonded on a PCB substrate. First, relevant literature about thermal management of LED systems and standard approaches for junction temperature measurements are given. Then, the thermography system is introduced, and the implementation of the measurement procedure is discussed. The emissivity correction is an important part of the calibration of the system and is described in detail. A thorough thermal analysis has been conducted using the novel micro-thermography approach and the results are used for determining the thermal resistance of the system under analysis. Furthermore, a thermal simulation has been conducted using Finite Element Modeling. The model and meshing are described, and initial simulation results are given. The experimental data is then used to modify the thermal simulation model to accurately represent the thermal behavior of the system.
UR - http://www.scopus.com/inward/record.url?scp=85122243631&partnerID=8YFLogxK
U2 - 10.1016/j.mee.2021.111694
DO - 10.1016/j.mee.2021.111694
M3 - Article
AN - SCOPUS:85122243631
VL - 254
JO - Microelectronic engineering
JF - Microelectronic engineering
SN - 0167-9317
M1 - 111694
ER -