Details
| Original language | English |
|---|---|
| Title of host publication | Electrical Performance of Electronic Packaging |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 97-100 |
| Number of pages | 4 |
| ISBN (electronic) | 0780381289, 9780780381285 |
| Publication status | Published - 2003 |
| Event | Electrical Performance of Electronic Packaging, 2003 - Princeton, United States Duration: 27 Oct 2003 → 29 Oct 2003 |
Publication series
| Name | Electrical Performance of Electronic Packaging |
|---|
Abstract
The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Computer Science(all)
- Hardware and Architecture
Cite this
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Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. p. 97-100 1250008 (Electrical Performance of Electronic Packaging).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Determination of frequency dependent transmission line parameters on product related on chip test line structures using s-parameter measurements
AU - Winkel, Thomas Michael
AU - Faiez Ktata, M.
AU - Ludwig, Thomas
AU - Scheltler, Helmut
AU - Grabinski, Hartmut
AU - Klink, Erich
PY - 2003
Y1 - 2003
N2 - The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
AB - The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters will be determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to non ideal chip environment will be shown and discussed. Measured and simulated results show a very good agreement.
UR - http://www.scopus.com/inward/record.url?scp=84889284589&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2003.1250008
DO - 10.1109/EPEP.2003.1250008
M3 - Conference contribution
AN - SCOPUS:84889284589
T3 - Electrical Performance of Electronic Packaging
SP - 97
EP - 100
BT - Electrical Performance of Electronic Packaging
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Electrical Performance of Electronic Packaging, 2003
Y2 - 27 October 2003 through 29 October 2003
ER -