Details
| Original language | English |
|---|---|
| Article number | 6332572 |
| Pages (from-to) | 3843-3846 |
| Number of pages | 4 |
| Journal | IEEE transactions on magnetics |
| Volume | 48 |
| Issue number | 11 |
| Publication status | Published - 2012 |
Abstract
In contrast to existing microelectromechanical systems (MEMS), this paper describes the development, fabrication, and testing of an anisotropic magnetoresistance (AMR) microsensor using a 7 μm thick polymer foil as substrate material. The modular magnetic field micro sensors are fabricated on a standard 4 in Si Wafer due to handling purposes during the sensor fabrication process. To enable a release of the micro sensors at the end of the fabrication process, initial investigations concentrated on the proof of principle applying a deep reactive-ion etching (DRIE) process to structure the Si wafer. The DRIE process was used to structure Si frames, which serve as carriers for the modular magnetic field micro sensors. For the evaluation of the fabricated modular magnetic field micro sensors, electrical resistance measurements were accomplished. The aim of these investigations was the characterization of the magnetic field dependence of the electrical resistance. The electrical output signal of the AMR sensors were subsequently compared to electrical resistance measurements of AMR sensors fabricated on a Si substrate and served as reference. The measurement results show a marginal effect of the substrate material on the characteristics of the AMR sensors.
Keywords
- Flexible polymer foils, magnetic microsensors, microsensor fabrication, modular sensor concept
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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In: IEEE transactions on magnetics, Vol. 48, No. 11, 6332572, 2012, p. 3843-3846.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Design, fabrication, and testing of a modular magnetic field microsensor on a flexible polymer foil
AU - Griesbach, Tim
AU - Wurz, Marc Christopher
AU - Rissing, Lutz
N1 - Funding Information: This work was supported in part by the German Research Foundation (DFG) within the Collaborative Research Center (SFB) 653 “Gentelligent Components in their Lifecycle.”
PY - 2012
Y1 - 2012
N2 - In contrast to existing microelectromechanical systems (MEMS), this paper describes the development, fabrication, and testing of an anisotropic magnetoresistance (AMR) microsensor using a 7 μm thick polymer foil as substrate material. The modular magnetic field micro sensors are fabricated on a standard 4 in Si Wafer due to handling purposes during the sensor fabrication process. To enable a release of the micro sensors at the end of the fabrication process, initial investigations concentrated on the proof of principle applying a deep reactive-ion etching (DRIE) process to structure the Si wafer. The DRIE process was used to structure Si frames, which serve as carriers for the modular magnetic field micro sensors. For the evaluation of the fabricated modular magnetic field micro sensors, electrical resistance measurements were accomplished. The aim of these investigations was the characterization of the magnetic field dependence of the electrical resistance. The electrical output signal of the AMR sensors were subsequently compared to electrical resistance measurements of AMR sensors fabricated on a Si substrate and served as reference. The measurement results show a marginal effect of the substrate material on the characteristics of the AMR sensors.
AB - In contrast to existing microelectromechanical systems (MEMS), this paper describes the development, fabrication, and testing of an anisotropic magnetoresistance (AMR) microsensor using a 7 μm thick polymer foil as substrate material. The modular magnetic field micro sensors are fabricated on a standard 4 in Si Wafer due to handling purposes during the sensor fabrication process. To enable a release of the micro sensors at the end of the fabrication process, initial investigations concentrated on the proof of principle applying a deep reactive-ion etching (DRIE) process to structure the Si wafer. The DRIE process was used to structure Si frames, which serve as carriers for the modular magnetic field micro sensors. For the evaluation of the fabricated modular magnetic field micro sensors, electrical resistance measurements were accomplished. The aim of these investigations was the characterization of the magnetic field dependence of the electrical resistance. The electrical output signal of the AMR sensors were subsequently compared to electrical resistance measurements of AMR sensors fabricated on a Si substrate and served as reference. The measurement results show a marginal effect of the substrate material on the characteristics of the AMR sensors.
KW - Flexible polymer foils
KW - magnetic microsensors
KW - microsensor fabrication
KW - modular sensor concept
UR - http://www.scopus.com/inward/record.url?scp=84867798601&partnerID=8YFLogxK
U2 - 10.1109/TMAG.2012.2198798
DO - 10.1109/TMAG.2012.2198798
M3 - Article
AN - SCOPUS:84867798601
VL - 48
SP - 3843
EP - 3846
JO - IEEE transactions on magnetics
JF - IEEE transactions on magnetics
SN - 0018-9464
IS - 11
M1 - 6332572
ER -