Details
| Original language | English |
|---|---|
| Title of host publication | Advances in Abrasive Technology XVI |
| Pages | 183-188 |
| Number of pages | 6 |
| Publication status | Published - 27 Sept 2013 |
| Event | 16th International Symposium on Advances in Abrasive Technology, ISAAT 2013 and 17th Chinese Conference of Abrasive Technology, CCAT 2013 - Hangzhou, China Duration: 23 Sept 2013 → 26 Sept 2013 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 797 |
| ISSN (Print) | 1022-6680 |
Abstract
In order to increase tool life and workpiece surface quality, cutting processes with geometrically defined cutting edges demand inserts with a targeted prepared edge. For example, chamfers are largely used in many processes to provide edge strengthening without damaging the chip flow. In order to achieve a stable and reliable cutting process, small and uniform chamfers are necessary. In this context, the influence of grinding parameters on the edge quality and on the chamfer width deviations is investigated. It was found that larger abrasive grains increase edge chipping and that elastic deformation during chamfer grinding at insert corner radius is the main responsible for chamfer width deviation.
Keywords
- Cutting edge preparation, Grinding, PCBN
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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Advances in Abrasive Technology XVI. 2013. p. 183-188 (Advanced Materials Research; Vol. 797).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Cutting edge preparation of PCBN inserts
AU - Denkena, B.
AU - Köhler, J.
AU - Ventura, C. E.H.
PY - 2013/9/27
Y1 - 2013/9/27
N2 - In order to increase tool life and workpiece surface quality, cutting processes with geometrically defined cutting edges demand inserts with a targeted prepared edge. For example, chamfers are largely used in many processes to provide edge strengthening without damaging the chip flow. In order to achieve a stable and reliable cutting process, small and uniform chamfers are necessary. In this context, the influence of grinding parameters on the edge quality and on the chamfer width deviations is investigated. It was found that larger abrasive grains increase edge chipping and that elastic deformation during chamfer grinding at insert corner radius is the main responsible for chamfer width deviation.
AB - In order to increase tool life and workpiece surface quality, cutting processes with geometrically defined cutting edges demand inserts with a targeted prepared edge. For example, chamfers are largely used in many processes to provide edge strengthening without damaging the chip flow. In order to achieve a stable and reliable cutting process, small and uniform chamfers are necessary. In this context, the influence of grinding parameters on the edge quality and on the chamfer width deviations is investigated. It was found that larger abrasive grains increase edge chipping and that elastic deformation during chamfer grinding at insert corner radius is the main responsible for chamfer width deviation.
KW - Cutting edge preparation
KW - Grinding
KW - PCBN
UR - http://www.scopus.com/inward/record.url?scp=84886928576&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.797.183
DO - 10.4028/www.scientific.net/AMR.797.183
M3 - Conference contribution
AN - SCOPUS:84886928576
SN - 9783037858257
T3 - Advanced Materials Research
SP - 183
EP - 188
BT - Advances in Abrasive Technology XVI
T2 - 16th International Symposium on Advances in Abrasive Technology, ISAAT 2013 and 17th Chinese Conference of Abrasive Technology, CCAT 2013
Y2 - 23 September 2013 through 26 September 2013
ER -