Details
| Original language | English |
|---|---|
| Title of host publication | 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9781944543013 |
| Publication status | Published - 21 Feb 2017 |
| Event | 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017 - Kauai, United States Duration: 6 Feb 2017 → 9 Feb 2017 |
Publication series
| Name | 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017 |
|---|
Abstract
The downscaling in VLSI systems and the use of new materials influences the reliability of components in terms of radiation more and more. The unavoidable presence of particle radiation on ground and in space leads to unwanted failures in the electronic devices. Concerning packaging materials, design and technology a lot of steps were done to avoid radiation sensitivity. Nowadays microelectronic for automotive systems are tested to withstand radiation especially SEU-single event upsets. Especially since the Toyota Prius problem [1] it is clear that SEU cannot be ignored. Another application are unmanned autonomous vehicles and systems. Nevertheless reliability testing is expensive and extreme time consuming. The use of COTS-Commercials of the shelf is the ultimate goal to reach. In this paper an overview about the main influences concerning radiation hardness and COTS will be discussed. Furthermore different simulation approaches will be presented and discussed.
Keywords
- Metallization, Packaging, Radiation, Reliability, Simulation, SRAM
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
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2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7859581 (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - COTS-radiation effects approaches and considerations
AU - Weide-Zaage, Kirsten
AU - Eichin, Philemon
AU - Chen, Chen
AU - Zhao, Yupeng
AU - Zhao, Lifan
N1 - Publisher Copyright: © 2017 SMTA. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/2/21
Y1 - 2017/2/21
N2 - The downscaling in VLSI systems and the use of new materials influences the reliability of components in terms of radiation more and more. The unavoidable presence of particle radiation on ground and in space leads to unwanted failures in the electronic devices. Concerning packaging materials, design and technology a lot of steps were done to avoid radiation sensitivity. Nowadays microelectronic for automotive systems are tested to withstand radiation especially SEU-single event upsets. Especially since the Toyota Prius problem [1] it is clear that SEU cannot be ignored. Another application are unmanned autonomous vehicles and systems. Nevertheless reliability testing is expensive and extreme time consuming. The use of COTS-Commercials of the shelf is the ultimate goal to reach. In this paper an overview about the main influences concerning radiation hardness and COTS will be discussed. Furthermore different simulation approaches will be presented and discussed.
AB - The downscaling in VLSI systems and the use of new materials influences the reliability of components in terms of radiation more and more. The unavoidable presence of particle radiation on ground and in space leads to unwanted failures in the electronic devices. Concerning packaging materials, design and technology a lot of steps were done to avoid radiation sensitivity. Nowadays microelectronic for automotive systems are tested to withstand radiation especially SEU-single event upsets. Especially since the Toyota Prius problem [1] it is clear that SEU cannot be ignored. Another application are unmanned autonomous vehicles and systems. Nevertheless reliability testing is expensive and extreme time consuming. The use of COTS-Commercials of the shelf is the ultimate goal to reach. In this paper an overview about the main influences concerning radiation hardness and COTS will be discussed. Furthermore different simulation approaches will be presented and discussed.
KW - Metallization
KW - Packaging
KW - Radiation
KW - Reliability
KW - Simulation
KW - SRAM
UR - http://www.scopus.com/inward/record.url?scp=85015775510&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85015775510
T3 - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
BT - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017
Y2 - 6 February 2017 through 9 February 2017
ER -