Details
Original language | English |
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Title of host publication | European Solid-State Device Research Conference |
Editors | H. Grunbacher |
Publisher | IEEE Computer Society |
Pages | 544-547 |
Number of pages | 4 |
ISBN (electronic) | 2863322214 |
Publication status | Published - 1997 |
Externally published | Yes |
Event | 27th European Solid-State Device Research Conference, ESSDERC 1997 - Stuttgart, Germany Duration: 22 Sept 1997 → 24 Sept 1997 |
Publication series
Name | European Solid-State Device Research Conference |
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ISSN (Print) | 1930-8876 |
Abstract
In this paper, we examine the possibility of sustaining steep B pro les in thin SiGe base layers (25 nm) under real HBT process conditions. Transient enhanced diffusion (TED) due to post-epitaxial implantations is shown to be the main source for outdiffusion of B from the SiGe. We report on a way to suppress TED effects by C incorporation into the epitaxial layer, allowing post-epitaxial implantation to be used in HBT processing.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Safety, Risk, Reliability and Quality
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European Solid-State Device Research Conference. ed. / H. Grunbacher. IEEE Computer Society, 1997. p. 544-547 (European Solid-State Device Research Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Control of steep Boron profiles in Si/SiGe heterojunction bipolar transistors
AU - Heinemann, B.
AU - Knoll, D.
AU - Fischer, G.
AU - Kruger, D.
AU - Lippert, G.
AU - Osten, H. J.
AU - Rucker, H.
AU - Ropke, W.
AU - Schley, P.
AU - Tillack, B.
PY - 1997
Y1 - 1997
N2 - In this paper, we examine the possibility of sustaining steep B pro les in thin SiGe base layers (25 nm) under real HBT process conditions. Transient enhanced diffusion (TED) due to post-epitaxial implantations is shown to be the main source for outdiffusion of B from the SiGe. We report on a way to suppress TED effects by C incorporation into the epitaxial layer, allowing post-epitaxial implantation to be used in HBT processing.
AB - In this paper, we examine the possibility of sustaining steep B pro les in thin SiGe base layers (25 nm) under real HBT process conditions. Transient enhanced diffusion (TED) due to post-epitaxial implantations is shown to be the main source for outdiffusion of B from the SiGe. We report on a way to suppress TED effects by C incorporation into the epitaxial layer, allowing post-epitaxial implantation to be used in HBT processing.
UR - http://www.scopus.com/inward/record.url?scp=84907551609&partnerID=8YFLogxK
U2 - 10.1109/ESSDERC.1997.194486
DO - 10.1109/ESSDERC.1997.194486
M3 - Conference contribution
AN - SCOPUS:84907551609
T3 - European Solid-State Device Research Conference
SP - 544
EP - 547
BT - European Solid-State Device Research Conference
A2 - Grunbacher, H.
PB - IEEE Computer Society
T2 - 27th European Solid-State Device Research Conference, ESSDERC 1997
Y2 - 22 September 1997 through 24 September 1997
ER -