Details
| Original language | English |
|---|---|
| Article number | 5982104 |
| Pages (from-to) | 504-506 |
| Number of pages | 3 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Volume | 21 |
| Issue number | 9 |
| Publication status | Published - Sept 2011 |
Abstract
An introduction to contactless vector network analysis is given for the determination of the scattering parameters of embedded devices. In the measurement setup, contactless probes are connected to a conventional vector network analyzer. Suitable probes are developed for the implementation of a contactless measurement setup, whereas the positioning of the probes is essential for an accurate measurement setup. The contactlessly measured results are compared to results received with a conventional vector network analyzer. These comparisons show that it is possible to characterize embedded devices with the contactless vector network analysis at least up to 6 GHz using the suggested probes.
Keywords
- Calibration technique, contactless scattering-parameter measurement, electromagnetic probe, microwave circuit testing, vector network analyzer (VNA)
ASJC Scopus subject areas
- Physics and Astronomy(all)
- Condensed Matter Physics
- Engineering(all)
- Electrical and Electronic Engineering
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In: IEEE Microwave and Wireless Components Letters, Vol. 21, No. 9, 5982104, 09.2011, p. 504-506.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Contactless scattering parameter measurements
AU - Zelder, Thomas
AU - Geck, Bernd
N1 - Funding Information: Manuscript received February 24, 2011; revised June 08, 2011; accepted June 22, 2011. Date of publication August 12, 2011; date of current version September 02, 2011. This work was supported by Rosenberger Hochfrequen-ztechnik GmbH & Co. KG and also by Rohde & Schwarz GmbH & Co. KG and SUSS MicroTec. T. Zelder is with Panasonic Electronic Devices Europe GmbH, Lüneburg 21337, Germany (e-mail: thomas.zelder@eu.panasonic.com). B. Geck is with the Institute of Radiofrequency and Microwave Engineering, Leibniz Universität Hannover, Hannover 30167, Germany. Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/LMWC.2011.2162619
PY - 2011/9
Y1 - 2011/9
N2 - An introduction to contactless vector network analysis is given for the determination of the scattering parameters of embedded devices. In the measurement setup, contactless probes are connected to a conventional vector network analyzer. Suitable probes are developed for the implementation of a contactless measurement setup, whereas the positioning of the probes is essential for an accurate measurement setup. The contactlessly measured results are compared to results received with a conventional vector network analyzer. These comparisons show that it is possible to characterize embedded devices with the contactless vector network analysis at least up to 6 GHz using the suggested probes.
AB - An introduction to contactless vector network analysis is given for the determination of the scattering parameters of embedded devices. In the measurement setup, contactless probes are connected to a conventional vector network analyzer. Suitable probes are developed for the implementation of a contactless measurement setup, whereas the positioning of the probes is essential for an accurate measurement setup. The contactlessly measured results are compared to results received with a conventional vector network analyzer. These comparisons show that it is possible to characterize embedded devices with the contactless vector network analysis at least up to 6 GHz using the suggested probes.
KW - Calibration technique
KW - contactless scattering-parameter measurement
KW - electromagnetic probe
KW - microwave circuit testing
KW - vector network analyzer (VNA)
UR - http://www.scopus.com/inward/record.url?scp=80052606134&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2011.2162619
DO - 10.1109/LMWC.2011.2162619
M3 - Article
AN - SCOPUS:80052606134
VL - 21
SP - 504
EP - 506
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
SN - 1531-1309
IS - 9
M1 - 5982104
ER -