Details
| Original language | English |
|---|---|
| Title of host publication | 2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9789075815375 |
| ISBN (print) | 978-1-6654-3384-6 |
| Publication status | Published - 6 Sept 2021 |
| Event | 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe - Ghent, Belgium Duration: 6 Sept 2021 → 10 Sept 2021 |
Publication series
| Name | 2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe |
|---|
Abstract
In power modules, negative temperature coefficient (NTC) sensors used for temperature measurement are often located at the edge of the module due to isolation constraints. This paper discusses the idea of mounting an NTC temperature sensor directly onto an IGBT chip and connecting it in parallel to the IGBT gate and auxiliary (Kelvin) emitter contacts, requiring no additional isolation and no additional external connections.
Keywords
- IGBT, junction temperature, measurements, module temperature measurement, NTC sensor, power semiconductor device
ASJC Scopus subject areas
- Energy(all)
- Energy Engineering and Power Technology
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Safety, Risk, Reliability and Quality
Cite this
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2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe. Institute of Electrical and Electronics Engineers Inc., 2021. (2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Contact-integrated temperature measurement for power modules
AU - Frohling, Soren
AU - Herwig, Daniel
AU - Mertens, Axel
PY - 2021/9/6
Y1 - 2021/9/6
N2 - In power modules, negative temperature coefficient (NTC) sensors used for temperature measurement are often located at the edge of the module due to isolation constraints. This paper discusses the idea of mounting an NTC temperature sensor directly onto an IGBT chip and connecting it in parallel to the IGBT gate and auxiliary (Kelvin) emitter contacts, requiring no additional isolation and no additional external connections.
AB - In power modules, negative temperature coefficient (NTC) sensors used for temperature measurement are often located at the edge of the module due to isolation constraints. This paper discusses the idea of mounting an NTC temperature sensor directly onto an IGBT chip and connecting it in parallel to the IGBT gate and auxiliary (Kelvin) emitter contacts, requiring no additional isolation and no additional external connections.
KW - IGBT
KW - junction temperature
KW - measurements
KW - module temperature measurement
KW - NTC sensor
KW - power semiconductor device
UR - http://www.scopus.com/inward/record.url?scp=85119074129&partnerID=8YFLogxK
U2 - 10.23919/EPE21ECCEEurope50061.2021.9570462
DO - 10.23919/EPE21ECCEEurope50061.2021.9570462
M3 - Conference contribution
AN - SCOPUS:85119074129
SN - 978-1-6654-3384-6
T3 - 2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe
BT - 2021 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd European Conference on Power Electronics and Applications, EPE 2021 ECCE Europe
Y2 - 6 September 2021 through 10 September 2021
ER -