Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Scott Manifold
  • Georgina Klemencic
  • Evan L.H. Thomas
  • Soumen Mandal
  • Henry Alexander Bland
  • Sean R. Giblin
  • Oliver A. Williams

External Research Organisations

  • Cardiff University
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Details

Original languageEnglish
Pages (from-to)13-19
Number of pages7
JournalCARBON
Volume179
Publication statusPublished - Jul 2021
Externally publishedYes

Abstract

Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.

Keywords

    Contact resistance, Diamond: boron doped, Metal contacts, Superconductivity

ASJC Scopus subject areas

Cite this

Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K. / Manifold, Scott; Klemencic, Georgina; Thomas, Evan L.H. et al.
In: CARBON, Vol. 179, 07.2021, p. 13-19.

Research output: Contribution to journalArticleResearchpeer review

Manifold S, Klemencic G, Thomas ELH, Mandal S, Bland HA, Giblin SR et al. Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K. CARBON. 2021 Jul;179:13-19. doi: 10.1016/j.carbon.2021.02.079
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abstract = "Diamond is a material that offers potential in numerous device applications. In particular, highly boron doped diamond is attractive due to its superconductivity and high Young's Modulus. The fabrication of stable, low resistance, ohmic contacts is essential to ensure proper device function. Previous work has established the efficacy of several methods of forming suitable contacts to diamond at room temperature and above, including carbide forming and carbon soluble metallisation schemes. Herein, the stability of several contact schemes (Ti, Cr, Mo, Ta and Pd) to highly boron doped nanocrystalline diamond was verified down to the cryogenic temperatures with modified Transmission Line Model (TLM) measurements. While all contact schemes remained ohmic, a significant temperature dependency is noted at T c and at the lowest temperatures the contact resistances ranged from Ti/Pt/Au with (8.83 ± 0.10) × 10 −4 Ω cm to Ta/Pt/Au with (8.07 ± 0.62) × 10 −6 Ω cm.",
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AU - Klemencic, Georgina

AU - Thomas, Evan L.H.

AU - Mandal, Soumen

AU - Bland, Henry Alexander

AU - Giblin, Sean R.

AU - Williams, Oliver A.

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KW - Contact resistance

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