Contact mechanics and friction processes in ultrasonic wire bonding -: Basic theories and experimental investigations

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Yangyang Long
  • Jens Twiefel
  • Jörg Wallaschek
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Details

Original languageEnglish
Article number115021
JournalJournal of sound and vibration
Volume468
Early online date17 Oct 2019
Publication statusPublished - 3 Mar 2020

Keywords

    Bonding mechanisms, Contact and friction, Relative motion, Ultrasonic wire bonding

ASJC Scopus subject areas

Cite this

Contact mechanics and friction processes in ultrasonic wire bonding -: Basic theories and experimental investigations. / Long, Yangyang; Twiefel, Jens; Wallaschek, Jörg.
In: Journal of sound and vibration, Vol. 468, 115021, 03.03.2020.

Research output: Contribution to journalArticleResearchpeer review

Long Y, Twiefel J, Wallaschek J. Contact mechanics and friction processes in ultrasonic wire bonding -: Basic theories and experimental investigations. Journal of sound and vibration. 2020 Mar 3;468:115021. Epub 2019 Oct 17. doi: 10.1016/j.jsv.2019.115021
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author = "Yangyang Long and Jens Twiefel and J{\"o}rg Wallaschek",
note = "Funding Information: We gratefully acknowledge the support from the DFG (Deutsche Forschungsgemeinschaft) program [ TW75/8-1|WA564/40-1] . Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Laser Zentrum Hannover e.V. for providing the illumination laser.",
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AU - Long, Yangyang

AU - Twiefel, Jens

AU - Wallaschek, Jörg

N1 - Funding Information: We gratefully acknowledge the support from the DFG (Deutsche Forschungsgemeinschaft) program [ TW75/8-1|WA564/40-1] . Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Laser Zentrum Hannover e.V. for providing the illumination laser.

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