Details
| Original language | English |
|---|---|
| Title of host publication | Nano and Micro Materials, Devices and Systems; Microsystems Integration |
| Publisher | American Society of Mechanical Engineers(ASME) |
| Pages | 447-454 |
| Number of pages | 8 |
| ISBN (print) | 9780791854976 |
| Publication status | Published - 2011 |
| Event | ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 - Denver, CO, United States Duration: 11 Nov 2011 → 17 Nov 2011 |
Publication series
| Name | ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 |
|---|---|
| Volume | 11 |
Abstract
For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.
ASJC Scopus subject areas
- Engineering(all)
- Mechanical Engineering
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Nano and Micro Materials, Devices and Systems; Microsystems Integration. American Society of Mechanical Engineers(ASME), 2011. p. 447-454 (ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011; Vol. 11).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Considerations on ultra-thin substrate-less micro and nano systems
AU - Gatzen, Hans H.
AU - Griesbach, Tim
AU - Wurz, Marc C.
AU - Rissing, Lutz
PY - 2011
Y1 - 2011
N2 - For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.
AB - For accomplishing ultra-thin micro and nano electromechanical mechanical systems (MEMS / NEMS), we are proposing an approach with substrate-less devices. Instead of fabricating thin devices on regular thickness wafers and thinning down the wafer at the end, the new devices are still fabricated on a thick handling wafer, but are released from them. This is done by means of a sacrificial layer below the device dissolved at the end of the wafer fabrication process. For still achieving sufficient device stiffness, an organic carrier-foil is integrated into the component, resulting in a flexible part with similarities to a macroscopic decal. For avoiding a warping particularly for multilayer devices, a compensation of the film is necessary.
UR - http://www.scopus.com/inward/record.url?scp=84869175147&partnerID=8YFLogxK
U2 - 10.1115/imece2011-62916
DO - 10.1115/imece2011-62916
M3 - Conference contribution
AN - SCOPUS:84869175147
SN - 9780791854976
T3 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
SP - 447
EP - 454
BT - Nano and Micro Materials, Devices and Systems; Microsystems Integration
PB - American Society of Mechanical Engineers(ASME)
T2 - ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Y2 - 11 November 2011 through 17 November 2011
ER -