Details
| Original language | English |
|---|---|
| Pages (from-to) | 9-13 |
| Number of pages | 5 |
| Journal | Procedia Manufacturing |
| Volume | 52 |
| Early online date | 24 Dec 2020 |
| Publication status | Published - 2020 |
| Event | 5th International Conference on System-Integrated Intelligence - Bremen, Germany Duration: 11 Nov 2020 → 13 Nov 2020 Conference number: 5 |
Abstract
Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.
Keywords
- Automation, Bonding, Contactless Transfer, Laser
ASJC Scopus subject areas
- Engineering(all)
- Industrial and Manufacturing Engineering
- Computer Science(all)
- Artificial Intelligence
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In: Procedia Manufacturing, Vol. 52, 2020, p. 9-13.
Research output: Contribution to journal › Conference article › Research › peer review
}
TY - JOUR
T1 - Concept of a Bonding Technology for Dies below 150 Micrometers
AU - Gottwald, Simon Nicolas
AU - Reitz, Birger
AU - Albrecht, Daniel
AU - Overmeyer, Ludger
N1 - Conference code: 5
PY - 2020
Y1 - 2020
N2 - Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.
AB - Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.
KW - Automation
KW - Bonding
KW - Contactless Transfer
KW - Laser
UR - http://www.scopus.com/inward/record.url?scp=85100790536&partnerID=8YFLogxK
U2 - 10.1016/j.promfg.2020.11.003
DO - 10.1016/j.promfg.2020.11.003
M3 - Conference article
AN - SCOPUS:85100790536
VL - 52
SP - 9
EP - 13
JO - Procedia Manufacturing
JF - Procedia Manufacturing
SN - 2351-9789
T2 - 5th International Conference on System-Integrated Intelligence
Y2 - 11 November 2020 through 13 November 2020
ER -