Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | IEEE 68th Electronic Components and Technology Conference, ECTC 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 932-939 |
| Number of pages | 8 |
| ISBN (print) | 9781538649985 |
| Publication status | Published - 7 Aug 2018 |
| Event | 68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2018-May |
| ISSN (Print) | 0569-5503 |
Abstract
The approach developed between the Institute of Micro Production Technology and LPKF Laser & Electronics AG follows a different strategy. The substrate itself is used as a functional part based on the technology of Molded Interconnected Devices (MID). The basis of this technology is a plastic substrate. In this work, a laser beam will be used as structuring tool by instigates an ablation of the organic compound. As a result of this ablation process the inorganic bulking agent will be uncovered. This agent can be metallized by electroless deposition of metals i.e. copper. This method made it possible to achieve near-surface structuring for the realization of trace parts, but through hole vias can also be achieved by combining the ablation process and electroless. To enhance the metallization an electrochemical process can be performed. For this new approach an injection molding process can be used to generate a planar plastic substrate in the shape and dimension of a conventional silicon wafer. In this case, the technology allows us to insert cavities into the substrate to create a 3D-microsystem instead of using etching technologies such as wet-chemical etching or deep reactive ion etching (DRIE). In detail, this technology approach offers the fabrication of e.g. lower coil systems with backside contact pads on injection molded plastic substrates. This means, that a many of necessary process steps for a micro system like a DC-DC transformer including the electrical contacts can be fabricated much easier and faster on a functional plastic substrate. In a clean-room environment, only a few process steps are required to complete the microsystem. The benefit of this approach is the reduction of fabrication steps inside a clean room and also the decrease of assembly steps. For example, wire bonding will be substituted completely by the created backside contact pads into the plastic substrate. It is also no longer necessary to integrate the system into a housing since the substrate itself will be the package after the microsystem is covered for example with a globe top sealing.
Keywords
- Laser direct structuring, MID, Packaging technology, Passive components, Polymer substrate, Prefabricated substrate
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 932-939 8429656 (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Concept for Using MID Technology for Advanced Packaging
AU - Wurz, Marc Christopher
AU - Roesener, Bernd
AU - Bengsch, Sebastian
AU - Beringer, Sebastian
N1 - Publisher Copyright: © 2018 IEEE. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - The approach developed between the Institute of Micro Production Technology and LPKF Laser & Electronics AG follows a different strategy. The substrate itself is used as a functional part based on the technology of Molded Interconnected Devices (MID). The basis of this technology is a plastic substrate. In this work, a laser beam will be used as structuring tool by instigates an ablation of the organic compound. As a result of this ablation process the inorganic bulking agent will be uncovered. This agent can be metallized by electroless deposition of metals i.e. copper. This method made it possible to achieve near-surface structuring for the realization of trace parts, but through hole vias can also be achieved by combining the ablation process and electroless. To enhance the metallization an electrochemical process can be performed. For this new approach an injection molding process can be used to generate a planar plastic substrate in the shape and dimension of a conventional silicon wafer. In this case, the technology allows us to insert cavities into the substrate to create a 3D-microsystem instead of using etching technologies such as wet-chemical etching or deep reactive ion etching (DRIE). In detail, this technology approach offers the fabrication of e.g. lower coil systems with backside contact pads on injection molded plastic substrates. This means, that a many of necessary process steps for a micro system like a DC-DC transformer including the electrical contacts can be fabricated much easier and faster on a functional plastic substrate. In a clean-room environment, only a few process steps are required to complete the microsystem. The benefit of this approach is the reduction of fabrication steps inside a clean room and also the decrease of assembly steps. For example, wire bonding will be substituted completely by the created backside contact pads into the plastic substrate. It is also no longer necessary to integrate the system into a housing since the substrate itself will be the package after the microsystem is covered for example with a globe top sealing.
AB - The approach developed between the Institute of Micro Production Technology and LPKF Laser & Electronics AG follows a different strategy. The substrate itself is used as a functional part based on the technology of Molded Interconnected Devices (MID). The basis of this technology is a plastic substrate. In this work, a laser beam will be used as structuring tool by instigates an ablation of the organic compound. As a result of this ablation process the inorganic bulking agent will be uncovered. This agent can be metallized by electroless deposition of metals i.e. copper. This method made it possible to achieve near-surface structuring for the realization of trace parts, but through hole vias can also be achieved by combining the ablation process and electroless. To enhance the metallization an electrochemical process can be performed. For this new approach an injection molding process can be used to generate a planar plastic substrate in the shape and dimension of a conventional silicon wafer. In this case, the technology allows us to insert cavities into the substrate to create a 3D-microsystem instead of using etching technologies such as wet-chemical etching or deep reactive ion etching (DRIE). In detail, this technology approach offers the fabrication of e.g. lower coil systems with backside contact pads on injection molded plastic substrates. This means, that a many of necessary process steps for a micro system like a DC-DC transformer including the electrical contacts can be fabricated much easier and faster on a functional plastic substrate. In a clean-room environment, only a few process steps are required to complete the microsystem. The benefit of this approach is the reduction of fabrication steps inside a clean room and also the decrease of assembly steps. For example, wire bonding will be substituted completely by the created backside contact pads into the plastic substrate. It is also no longer necessary to integrate the system into a housing since the substrate itself will be the package after the microsystem is covered for example with a globe top sealing.
KW - Laser direct structuring
KW - MID
KW - Packaging technology
KW - Passive components
KW - Polymer substrate
KW - Prefabricated substrate
UR - http://www.scopus.com/inward/record.url?scp=85051952046&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2018.00143
DO - 10.1109/ECTC.2018.00143
M3 - Conference contribution
AN - SCOPUS:85051952046
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 932
EP - 939
BT - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -