Details
| Original language | English |
|---|---|
| Title of host publication | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 |
| Pages | 21-24 |
| Number of pages | 4 |
| Publication status | Published - 2005 |
| Event | 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States Duration: 24 Oct 2005 → 26 Oct 2005 |
Publication series
| Name | IEEE Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Volume | 2005 |
Abstract
Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 21-24 1563690 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
AU - Winkel, Thomas Michael
AU - Deutsch, A.
AU - Katopis, George A.
AU - Kopcsay, G. V.
AU - Klink, E.
AU - Dyckman, W. D.
AU - Chamberlin, B. J.
AU - Grabinski, H.
AU - Surovic, C. W.
AU - Liu, H.
AU - Baks, C.
PY - 2005
Y1 - 2005
N2 - Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.
AB - Transmission line models and material parameters are extracted from time and frequency domain measurements for product related low loss card and ceramic MCM test line structures up to 65GHz. All measured results are compared to results as obtained from field calculations showing the advantages and limitations of the different methods on product driven test vehicles.
UR - http://www.scopus.com/inward/record.url?scp=33845912665&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2005.1563690
DO - 10.1109/EPEP.2005.1563690
M3 - Conference contribution
AN - SCOPUS:33845912665
SN - 0780392205
SN - 9780780392205
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 21
EP - 24
BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Y2 - 24 October 2005 through 26 October 2005
ER -