Chip formation in machining metal bonded grinding layers

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Berend Denkena
  • Thilo Grove
  • Vino Suntharakumaran
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Details

Original languageEnglish
Title of host publication6th CIRP Global Web Conference, CIRPe 2018
Subtitle of host publicationEnvisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era
EditorsAlessandro Simeone, Paolo C. Priarone
PublisherElsevier Science B.V.
Pages55-60
Number of pages6
ISBN (electronic)9781510875692
Publication statusPublished - 24 Nov 2018
Event6th CIRP Global Web Conference, CIRPe 2018 -
Duration: 23 Oct 201825 Oct 2018

Publication series

NameProcedia CIRP
Volume78
ISSN (Print)2212-8271

Abstract

Gears demand increasingly high quality regarding acoustic emissions, surface roughness and lifetime. Therefore, grinding is often the last step in the process chain of gear manufacturing. Grinding wheel grain sizes of 30 micrometers lead to high surface quality and metal bonded CBN-grains allow a high wear resistance and profile stability of the grinding tool. Consequently, an increase of the material removal rates and thus productivity is possible without increasing the thermal load on the workpiece due to the grinding wheels' high thermal conductivity. However, the time and cost intensive dressing process in combination with the high profile requirements for gear grinding prevent the wide application of metal bonded tools for this application. This challenge can be solved using a new dressing approach with geometrically defined cutting edges. Metal bonded CBN-grinding layers have a structure similar to metal-matrix-composites, which can be machined by using the turning operation. The aim of this work is to verify the machinability of metal bonded CBN-grinding layers. In the present work, the chip formation for metal bonded grinding layers is presented.

Keywords

    Dressing, Machinability, Metal matrix composite

ASJC Scopus subject areas

Cite this

Chip formation in machining metal bonded grinding layers. / Denkena, Berend; Grove, Thilo; Suntharakumaran, Vino.
6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. ed. / Alessandro Simeone; Paolo C. Priarone. Elsevier Science B.V., 2018. p. 55-60 (Procedia CIRP; Vol. 78).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Denkena, B, Grove, T & Suntharakumaran, V 2018, Chip formation in machining metal bonded grinding layers. in A Simeone & PC Priarone (eds), 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Procedia CIRP, vol. 78, Elsevier Science B.V., pp. 55-60, 6th CIRP Global Web Conference, CIRPe 2018, 23 Oct 2018. https://doi.org/10.1016/j.procir.2018.08.321
Denkena, B., Grove, T., & Suntharakumaran, V. (2018). Chip formation in machining metal bonded grinding layers. In A. Simeone, & P. C. Priarone (Eds.), 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era (pp. 55-60). (Procedia CIRP; Vol. 78). Elsevier Science B.V.. https://doi.org/10.1016/j.procir.2018.08.321
Denkena B, Grove T, Suntharakumaran V. Chip formation in machining metal bonded grinding layers. In Simeone A, Priarone PC, editors, 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. Elsevier Science B.V. 2018. p. 55-60. (Procedia CIRP). doi: 10.1016/j.procir.2018.08.321
Denkena, Berend ; Grove, Thilo ; Suntharakumaran, Vino. / Chip formation in machining metal bonded grinding layers. 6th CIRP Global Web Conference, CIRPe 2018: Envisaging the Future Manufacturing, Design, Technologies and Systems in Innovation Era. editor / Alessandro Simeone ; Paolo C. Priarone. Elsevier Science B.V., 2018. pp. 55-60 (Procedia CIRP).
Download
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