Details
| Original language | English |
|---|---|
| Title of host publication | Electrical Performance of Electronic Packaging, EPEP 1992 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 134-136 |
| Number of pages | 3 |
| ISBN (electronic) | 078030683X, 9780780306837 |
| Publication status | Published - 1992 |
| Event | 1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States Duration: 22 Apr 1992 → 24 Apr 1992 |
Publication series
| Name | Electrical Performance of Electronic Packaging, EPEP 1992 |
|---|
Abstract
With respect to signal propagation a PGA represents a very complex structure: lines of various geometries are embedded in different materials. This makes it very difficult to find a sufficiently simple circuit model to describe the electrical behaviour of the package based only on measurements/1/.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
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Electrical Performance of Electronic Packaging, EPEP 1992. Institute of Electrical and Electronics Engineers Inc., 1992. p. 134-136 572287 (Electrical Performance of Electronic Packaging, EPEP 1992).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Characterization of the electrical performance of PGA packages
AU - Zaage, S.
AU - Kannemacher, D.
AU - Grabinski, H.
PY - 1992
Y1 - 1992
N2 - With respect to signal propagation a PGA represents a very complex structure: lines of various geometries are embedded in different materials. This makes it very difficult to find a sufficiently simple circuit model to describe the electrical behaviour of the package based only on measurements/1/.
AB - With respect to signal propagation a PGA represents a very complex structure: lines of various geometries are embedded in different materials. This makes it very difficult to find a sufficiently simple circuit model to describe the electrical behaviour of the package based only on measurements/1/.
UR - http://www.scopus.com/inward/record.url?scp=85064760090&partnerID=8YFLogxK
U2 - 10.1109/EPEP.1992.572287
DO - 10.1109/EPEP.1992.572287
M3 - Conference contribution
AN - SCOPUS:85064760090
T3 - Electrical Performance of Electronic Packaging, EPEP 1992
SP - 134
EP - 136
BT - Electrical Performance of Electronic Packaging, EPEP 1992
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1992 Electrical Performance of Electronic Packaging, EPEP 1992
Y2 - 22 April 1992 through 24 April 1992
ER -