Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process

Research output: Contribution to conferencePaperResearchpeer review

Authors

  • H. J. Osten
  • D. Knoll
  • B. Heinemann
  • H. Rucker
  • K. E. Ehwald
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Details

Original languageEnglish
Pages19
Number of pages1
Publication statusPublished - 2000
Event12 Asia-Pacific Microwave Conference - Sydney, Australia
Duration: 3 Dec 20006 Dec 2000

Conference

Conference12 Asia-Pacific Microwave Conference
CitySydney, Australia
Period3 Dec 20006 Dec 2000

Abstract

The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

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Cite this

Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. / Osten, H. J.; Knoll, D.; Heinemann, B. et al.
2000. 19 Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia.

Research output: Contribution to conferencePaperResearchpeer review

Osten, HJ, Knoll, D, Heinemann, B, Rucker, H & Ehwald, KE 2000, 'Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process', Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia, 3 Dec 2000 - 6 Dec 2000 pp. 19.
Osten, H. J., Knoll, D., Heinemann, B., Rucker, H., & Ehwald, K. E. (2000). Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. 19. Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia.
Osten HJ, Knoll D, Heinemann B, Rucker H, Ehwald KE. Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. 2000. Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia.
Osten, H. J. ; Knoll, D. ; Heinemann, B. et al. / Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process. Paper presented at 12 Asia-Pacific Microwave Conference, Sydney, Australia.1 p.
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abstract = "The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.",
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T1 - Carbon doped SiGe heterojunction bipolar transistor module suitable for integration in a deep submicron CMOS process

AU - Osten, H. J.

AU - Knoll, D.

AU - Heinemann, B.

AU - Rucker, H.

AU - Ehwald, K. E.

PY - 2000

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N2 - The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

AB - The incorporation of low concentrations of carbon (<10 20 cm -3) into the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by subsequent processing steps. This effect can be described by coupled diffusion of carbon atoms and Si point defects. We discuss the increase in performance and process margins in SiGe heterojunction bipolar technology by adding carbon. SiGe:C HBTs demonstrate excellent static parameters, exceeding the performance of state-of-the art SiGe:C HBTs C also enhances the high frequency performance, because it allows one to use a high B doping level in a very thin SiGe base layer without outdiffusion from SiGe, even if applying post-epitaxial implants and anneals. Finally, we demonstrate the first modular integration of SiGe:C HBTs into a 0.25 μm, epi-free, dual-gate CMOS platform.

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