Broadband modeling and measurement of the signal behavior in S/390 MCM packages

Research output: Contribution to journalArticleResearchpeer review

Authors

  • Faïez M. Ktata
  • Uwe Arz
  • Hartmut Grabinski
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Details

Original languageEnglish
Pages (from-to)375-381
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume23
Issue number3
Publication statusPublished - 2000

Abstract

In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.

Keywords

    Electronic packaging, Finite element simulations, Lumped equivalent circuits, MCM, Parameter extraction, S-parameter measurement

ASJC Scopus subject areas

Cite this

Broadband modeling and measurement of the signal behavior in S/390 MCM packages. / Ktata, Faïez M.; Arz, Uwe; Grabinski, Hartmut.
In: IEEE Transactions on Advanced Packaging, Vol. 23, No. 3, 2000, p. 375-381.

Research output: Contribution to journalArticleResearchpeer review

Ktata, FM, Arz, U & Grabinski, H 2000, 'Broadband modeling and measurement of the signal behavior in S/390 MCM packages', IEEE Transactions on Advanced Packaging, vol. 23, no. 3, pp. 375-381. https://doi.org/10.1109/6040.861550
Ktata, F. M., Arz, U., & Grabinski, H. (2000). Broadband modeling and measurement of the signal behavior in S/390 MCM packages. IEEE Transactions on Advanced Packaging, 23(3), 375-381. https://doi.org/10.1109/6040.861550
Ktata FM, Arz U, Grabinski H. Broadband modeling and measurement of the signal behavior in S/390 MCM packages. IEEE Transactions on Advanced Packaging. 2000;23(3):375-381. doi: 10.1109/6040.861550
Ktata, Faïez M. ; Arz, Uwe ; Grabinski, Hartmut. / Broadband modeling and measurement of the signal behavior in S/390 MCM packages. In: IEEE Transactions on Advanced Packaging. 2000 ; Vol. 23, No. 3. pp. 375-381.
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